PTO
Wrapper
PDF
|
Dossier
Espace
Google
|
|
Patent
D936025
|
Priority
Dec 26 2018
|
Filed
Jun 26 2019
|
Issued
Nov 16 2021
|
Expiry
Nov 16 2036
|
|
Assg.orig
|
|
Entity
unknown
|
2
|
13
|
n/a
|
|
|
The ornamental design for a flexible printed circuit board for battery module, as shown and described.
|
FIG. 1 is a front perspective view of a flexible printed circuit board for battery module according to our design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a rear perspective view thereof.
The flexible printed circuit board (FPCB) for a battery module of this design is made of metal and synthetic resin.
The flexible printed circuit board (FPCB) for a battery module of this design is mainly used in an electric vehicle.
Color forms no part of the claimed design.
You, Jae-Hyun, Lee, Young-ho, Park, Do-Hyun, Jeong, Jong-Ha, Kwak, Jung-Min
Patent |
Priority |
Assignee |
Title |
10056669, |
Jun 16 2014 |
Murata Manufacturing Co., Ltd. |
Transmission line |
10893615, |
Dec 12 2016 |
VITESCO TECHNOLOGIES GERMANY GMBH |
Printed circuit board composite and method for producing same |
6227870, |
May 07 1999 |
Kyoshin Kogyo Co., Ltd. |
Connecting terminal and a connecting terminal assembly |
8342384, |
Mar 13 2002 |
ROGERS GERMANY GMBH |
Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate |
9713251, |
Dec 02 2011 |
Murata Manufacturing Co., Ltd. |
High-frequency signal line, method for producing same, and electronic device |
D740769, |
Mar 22 2013 |
KOKUSAI ELECTRIC CORPORATION |
Boat for substrate processing apparatus |
D805044, |
Oct 30 2015 |
HIRATA CORPORATION |
Adhesive sheet for substrate |
D877102, |
Dec 28 2017 |
Shindengen Electric Manufacturing Co., Ltd. |
Semiconductor module |
D886073, |
Jan 29 2018 |
GIGALANE CO , LTD |
Flexible printed circuit board |
D887998, |
Feb 17 2017 |
STAT PEEL AG |
Chip |
D903613, |
Jun 26 2018 |
Rohm Co., Ltd. |
Semiconductor module |
D913978, |
Jun 26 2018 |
Rohm Co., Ltd. |
Semiconductor module |
D920935, |
Sep 20 2018 |
KOKUSAI ELECTRIC CORPORATION |
Boat for substrate processing apparatus |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jun 21 2019 | JEONG, JONG-HA | LG Chem, Ltd | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 049651 | /0868 |
pdf |
Jun 21 2019 | PARK, DO-HYUN | LG Chem, Ltd | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 049651 | /0868 |
pdf |
Jun 21 2019 | LEE, YOUNG-HO | LG Chem, Ltd | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 049651 | /0868 |
pdf |
Jun 21 2019 | YOU, JAE-HYUN | LG Chem, Ltd | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 049651 | /0868 |
pdf |
Jun 24 2019 | KWAK, JUNG-MIN | LG Chem, Ltd | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 049651 | /0868 |
pdf |
Jun 26 2019 | | LG Chem, Ltd. | (assignment on the face of the patent) | | / |
Oct 27 2021 | LG Chem, Ltd | LG ENERGY SOLUTION, LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 058295 | /0068 |
pdf |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a