FIG. 1 is a front, top and left side perspective view of a boat for substrate processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof.
FIG. 8 is an enlarged portion view take along line 8 in FIG. 2 thereof;
FIG. 9 is a view take along line 9-9 in FIG. 2 thereof;
FIG. 10 is a view take along line 10-10 in FIG. 2 thereof;
FIG. 11 is a perspective view of the claimed portion indicated by the solid line in FIG. 8 thereof;
FIG. 12 is a front elevational view of the claimed portion indicated by the solid line in FIG. 8 thereof;
FIG. 13 is a rear elevational view of the claimed portion indicated by the solid line in FIG. 8 thereof;
FIG. 14 is a right side elevational view of the claimed portion indicated by the solid line in FIG. 8 thereof;
FIG. 15 is a left side elevational view of the claimed portion indicated by the solid line in FIG. 8 thereof;
FIG. 16 is a top plan elevational view of the claimed portion indicated by the solid line in FIG. 8 thereof; and,
FIG. 17 is a bottom plan elevational view of the claimed portion indicated by the solid line in FIG. 8.
The broken lines show portions of a boat for substrate processing apparatus that form no part of the claimed design.
The “dash-dot” broken line in FIG. 2 represents the bounds of the enlarged portion of the claimed design in FIG. 8
The “dash-dot” broken line in FIG. 2 also show the plan view from which FIGS. 9 and 10 are taken.
Patent |
Priority |
Assignee |
Title |
20130284683, |
|
|
|
20160093487, |
|
|
|
D655255, |
Jun 18 2010 |
KOKUSAI ELECTRIC CORPORATION |
Boat of wafer processing apparatus |
D655682, |
Jun 18 2010 |
KOKUSAI ELECTRIC CORPORATION |
Boat of wafer processing apparatus |
D734730, |
Dec 27 2012 |
KOKUSAI ELECTRIC CORPORATION |
Boat of substrate processing apparatus |
D737785, |
Jul 29 2013 |
KOKUSAI ELECTRIC CORPORATION |
Boat for substrate processing apparatus |
D738329, |
Jul 29 2013 |
KOKUSAI ELECTRIC CORPORATION |
Boat for substrate processing apparatus |
D739831, |
Mar 22 2013 |
KOKUSAI ELECTRIC CORPORATION |
Boat for substrate processing apparatus |
D740769, |
Mar 22 2013 |
KOKUSAI ELECTRIC CORPORATION |
Boat for substrate processing apparatus |
D747279, |
Jul 29 2013 |
KOKUSAI ELECTRIC CORPORATION |
Boat for substrate processing apparatus |
D769201, |
Nov 20 2014 |
Tokyo Electron Limited |
Wafer boat |
D772183, |
Nov 20 2014 |
Tokyo Electron Limited |
Wafer boat |
D789310, |
Nov 20 2014 |
Tokyo Electron Limited |
Wafer boat |
D791721, |
Nov 20 2014 |
Tokyo Electron Limited |
Wafer boat |
D827592, |
Jan 31 2017 |
HITACHI HIGH-TECH CORPORATION |
Electrode cover for a plasma processing apparatus |
D836572, |
Sep 30 2016 |
Applied Materials, Inc.; Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D836573, |
Jan 31 2017 |
HITACHI HIGH-TECH CORPORATION |
Ring for a plasma processing apparatus |
D839219, |
Feb 12 2016 |
KOKUSAI ELECTRIC CORPORATION |
Boat for substrate processing apparatus |
D843958, |
Aug 10 2017 |
KOKUSAI ELECTRIC CORPORATION |
Reaction tube |
D846514, |
May 03 2018 |
KOKUSAI ELECTRIC CORPORATION |
Boat of substrate processing apparatus |
D847105, |
May 03 2018 |
KOKUSAI ELECTRIC CORPORATION |
Boat of substrate processing apparatus |
D873782, |
May 17 2016 |
Electro Scientific Industries, Inc |
Component carrier plate |
D893438, |
Aug 21 2017 |
Tokyo Electron Limited |
Wafer boat |
JP1494458, |
|
|
|
JP1537629, |
|
|
|