FIG. 1 is a bottom perspective view of a module showing my new design;
FIG. 2 is a bottom elevation view of the module illustrated in FIG. 1;
FIG. 3 is a top elevation view of the module illustrated in FIG. 1;
FIG. 4 is a first side elevation view of the module illustrated in FIG. 1;
FIG. 5 is a second side elevation view of the module illustrated in FIG. 1;
FIG. 6 is a third side elevation view of the module illustrated in FIG. 1;
FIG. 7 is a fourth side elevation view of the module illustrated in FIG. 1;
FIG. 8 is a bottom perspective view of a module showing my new design;
FIG. 9 is a bottom elevation view of the module illustrated in FIG. 8;
FIG. 10 is a top elevation view of the module illustrated in FIG. 8;
FIG. 11 is a first side elevation view of the module illustrated in FIG. 8;
FIG. 12 is a second side elevation view of the module illustrated in FIG. 8;
FIG. 13 is a third side elevation view of the module illustrated in FIG. 8; and,
FIG. 14 is a fourth side elevation view of the module illustrated in FIG. 8.
In all of the FIGURES, the cross hatch represents a gold color, and the dashed lines represent a silver color.
| Patent |
Priority |
Assignee |
Title |
| 11333677, |
Jul 23 2018 |
CACI, Inc.—Federal |
Methods and apparatuses for detecting tamper using heuristic models |
| 11662698, |
Jul 23 2018 |
CACI, Inc.—Federal |
Methods and apparatuses for detecting tamper using machine learning models |
| 11747775, |
Jul 23 2018 |
CACI, Inc.—Federal |
Integrated tamper detection system and methods |
| D778850, |
May 15 2014 |
Kioxia Corporation |
Substrate for an electronic circuit |
| D778851, |
May 15 2014 |
Kioxia Corporation |
Substrate for an electronic circuit |
| D778852, |
May 15 2014 |
Kioxia Corporation |
Substrate for an electronic circuit |
| D784937, |
Nov 13 2014 |
Tokyo Electron Limited |
Dummy wafer |
| D785576, |
Nov 13 2014 |
Tokyo Electron Limited |
Dummy wafer |
| D786810, |
Nov 13 2014 |
Tokyo Electron Limited |
Dummy wafer |
| D813182, |
Aug 02 2016 |
PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD |
Semiconductor device |
| D822627, |
Jan 31 2017 |
Rohm Co., Ltd. |
Semiconductor device |
| D822628, |
Jan 31 2017 |
Rohm Co., Ltd. |
Semiconductor device |
| D822629, |
Jan 26 2017 |
Kyocera Corporation |
Semiconductor package |
| D823270, |
Sep 30 2016 |
Rohm Co., Ltd. |
Semiconductor device |
| D824344, |
May 26 2017 |
TINYPCB, INC |
Modular circuit board |
| D824345, |
May 26 2017 |
TINYPCB, INC |
Modular circuit board |
| D826186, |
May 26 2017 |
TINYPCB, INC |
Modular circuit board |
| D826187, |
May 26 2017 |
TINYPCB, INC |
Modular circuit board |
| D826188, |
May 26 2017 |
TINYPCB, INC |
Modular circuit board |
| D826189, |
May 26 2017 |
TINYPCB, INC |
Modular circuit board |
| D826190, |
May 26 2017 |
TINYPCB, INC |
Modular circuit board |
| D826191, |
May 26 2017 |
TINYPCB, INC |
Modular circuit board |
| D826192, |
May 26 2017 |
TINYPCB, INC |
Modular circuit board |
| D826193, |
May 26 2017 |
TINYPCB, INC |
Modular circuit board |
| D826194, |
May 26 2017 |
TINYPCB, INC |
Modular circuit board |
| D826195, |
May 26 2017 |
TINYPCB, INC |
Modular circuit board |
| D826196, |
May 26 2017 |
TINYPCB, INC |
Modular circuit board |
| D829674, |
May 26 2017 |
TINYPCB, INC |
Modular circuit board |
| D829675, |
May 26 2017 |
TINYPCB, INC |
Modular circuit board |
| D830318, |
May 26 2017 |
TINYPCB, INC |
Moduler circuit board |
| D830319, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
| D830320, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
| D830321, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
| D830348, |
Sep 26 2013 |
Murata Manufacturing Co., Ltd. |
Wireless transmission/reception module |
| D831009, |
Dec 11 2015 |
TELIT CINTERION DEUTSCHLAND GMBH |
Radio module |
| D832229, |
May 26 2017 |
TINYPCB, INC |
Modular circuit board |
| D833990, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
| D833991, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
| D833992, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
| D833993, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
| D833994, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
| D834546, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
| D839221, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
| D839222, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
| D839223, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
| D841605, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
| D841606, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
| D842256, |
May 16 2017 |
EM Devices Corporation |
Electromagnetic relay |
| D842260, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
| D847765, |
Mar 15 2017 |
EM Devices Corporation |
Electromagnetic relay |
| D859373, |
Sep 29 2017 |
Mitsubishi Electric Corporation |
Antenna element |
| D864882, |
Sep 27 2017 |
Hamamatsu Photonics K.K. |
Part for semiconductor device |
| D864883, |
Sep 27 2017 |
Hamamatsu Photonics K.K. |
Part for semiconductor device |
| D865690, |
Sep 27 2017 |
Hamamatsu Photonics K.K. |
Part for semiconductor device |
| D865726, |
Jan 13 2017 |
Impinj, Inc. |
Crossover for RFID IC terminals |
| D875057, |
May 26 2017 |
TINY PCB, Inc. |
Modular circuit board |
| D887400, |
Jan 13 2017 |
Impinj, Inc. |
Crossover for RFID IC terminals |
| D892774, |
Sep 26 2013 |
Murata Manufacturing Co., Ltd. |
Wireless transmission/reception module |
| D904355, |
Dec 11 2015 |
TELIT CINTERION DEUTSCHLAND GMBH |
Radio module |
| D934821, |
Jul 24 2019 |
NUVOTON TECHNOLOGY CORPORATION JAPAN |
Semiconductor device |
| D942974, |
Nov 20 2018 |
THALES DIS AIS DEUTSCHLAND GMBH |
Cellular module |
| D947800, |
Jul 16 2019 |
CACI, Inc.—Federal |
Integrated module |
| D947801, |
Nov 07 2019 |
Phoenix Contact GmbH & Co. KG |
Printed circuit board |
| D956707, |
Sep 26 2019 |
LAPIS SEMICONDUCTOR CO , LTD |
Circuit board |
| ER1930, |
|
|
|
| ER1993, |
|
|
|
| ER3567, |
|
|
|
| ER3700, |
|
|
|
| Patent |
Priority |
Assignee |
Title |
| 6181281, |
Nov 25 1998 |
NEC Corporation |
Single- and dual-mode patch antennas |
| 6384786, |
Jan 13 2000 |
Murata Manufacturing Co., Ltd. |
Antenna device and communication apparatus |
| 6531983, |
Jul 16 1999 |
Mitsubishi Materials Corporation |
Method for antenna assembly and an antenna assembly with a conductive film formed on convex portions |
| 7352328, |
Sep 27 2005 |
Samsung Electronics Co., Ltd. |
Flat-plate MIMO array antenna with isolation element |
| 8196829, |
Jun 23 2006 |
FRACTUS, S A |
Chip module, sim card, wireless device and wireless communication method |
| 8203488, |
Jan 21 2005 |
Fractus, S.A. |
Integrated circuit package including miniature antenna |
| 8610579, |
Jun 21 2006 |
NXP USA, INC |
RFID integrated circuit with integrated antenna structure |
| 20020033773, |
|
|
|
| 20030030587, |
|
|
|
| 20060054710, |
|
|
|
| 20070096993, |
|
|
|
| 20080062049, |
|
|
|
| 20100060454, |
|
|
|
| 20110051375, |
|
|
|
| 20110193761, |
|
|
|
| 20110304516, |
|
|
|
| 20120200462, |
|
|
|
| 20130314291, |
|
|
|
| 20150194730, |
|
|
|
| 20150340754, |
|
|
|
| 20160013557, |
|
|
|
| 20160079952, |
|
|
|
| D475700, |
Aug 30 2001 |
Mitsubishi Materials Corporation |
Antenna |
| D530708, |
Nov 26 2004 |
TAIYO YUDEN CO , LTD |
Radio-frequency module for a communication device |
| D533546, |
Sep 15 2005 |
Mitsumi Electric Co., Ltd. |
Antenna element |
| D540272, |
Apr 18 2005 |
Murata Manufacturing Co., Ltd. |
Semiconductor module |
| D599308, |
May 20 2008 |
DEKA Products Limited Partnership |
RFID antenna circuit board |
| D730328, |
Apr 25 2013 |
SAMSUNG ELECTRONICS CO , LTD |
Antenna |
| D755163, |
Mar 13 2014 |
Murata Manufacturing Co., Ltd. |
Antenna |
| RE45712, |
Mar 18 2013 |
AIO CORE CO , LTD |
Signal conversion device |