Patent
   D720311
Priority
Oct 17 2013
Filed
Apr 15 2014
Issued
Dec 30 2014
Expiry
Dec 30 2028
Assg.orig
Entity
unknown
3
27
n/a
The ornamental design for a coaxial waveguide converter substrate with filtering function, as shown and described.

FIG. 1 is a top plan view of a coaxial waveguide converter substrate with filtering function showing our new design;

FIG. 2 a bottom plan view thereof;

FIG. 3 is a left side elevation view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a front elevation view thereof;

FIG. 6 is a rear elevation view thereof; and,

FIG. 7 is a perspective view thereof.

Miyamoto, Takahiro, Shiroyama, Norihisa, Ueda, Sumio, Sasaki, Kiyotake

Patent Priority Assignee Title
D868604, Mar 18 2016 BAKER HUGHES HOLDINGS LLC; MANTHEY, DIANE, MANT Sensor
D909319, Jul 08 2020 Impact IP, LLC Circuit board
D960724, Jan 29 2020 TATSUTA ELECTRIC WIRE & CABLE CO , LTD Sheet sensor
Patent Priority Assignee Title
3737812,
4458222, May 06 1981 SGS-Thomson Microelectronics, Inc Waveguide to microstrip coupler wherein microstrip carries D.C. biased component
4602271, Jul 22 1981 International Business Machines Corporation Personalizable masterslice substrate for semiconductor chips
4652839, Jun 25 1984 ALPS Electric Co., Ltd. Waveguide-to-coaxial converter
5326284, Jun 26 1992 NORDX CDT, INC Circuit assemblies of printed circuit boards and telecommunications connectors
6232562, Sep 30 1998 Taiyo Yuden Co., Ltd.; TAIYO YUDEN CO , LTD Hybrid integrated circuit device
6788171, Mar 05 2002 XYTRANS, INC Millimeter wave (MMW) radio frequency transceiver module and method of forming same
7612632, Aug 01 2006 Denso Corporation Line-waveguide converter having plural electrode cells and radio communication device using such a converter
20030081393,
20030231078,
D319045, Apr 13 1988 IBIDEN CO , LTD , A JAPANESE CORP Semi-conductor substrate with conducting pattern
D319629, Apr 13 1988 IBIDEN CO , LTD , A JAPANESE CORP Semiconductor substrate with conducting pattern
D319814, Apr 13 1988 IBIDEN CO , LTD Semi-conductor substrate with conducting pattern
D397093, Jul 30 1997 BEST LIGHTING PRODUCTS, INC Printed circuit board with mounted components
D429704, Mar 10 1999 Printed circuit board for wireless telephones
D440209, Jul 28 1999 Panduit Corp Board of wireless frequency for amplification of transmitting and receiving electric wave
D442149, Mar 30 2000 Printed circuit board for a wireless telephone
D442150, Jul 24 2000 RF module board of wireless telephone
D457146, Nov 29 2000 Kabushiki Kaisha Kaisha Toshiba Substrate for a semiconductor element
D466093, Apr 27 2001 Taiyo Yuden Co., Ltd.; TAIYO YUDEN CO , LTD Hybird integrated circuit board
D471167, Apr 27 2001 Taiyo Yuden Co., Ltd. Hybrid integrated circuit board
D485536, Mar 10 2003 PULSE ELECTRONICS, INC Electronics component assembly
D505925, Dec 11 2003 Repeater circuit board design
D524763, Mar 08 2004 Mitsumi Electric Co., Ltd. Transmitting/receiving unit
D552048, Oct 26 2005 Hon Hai Precision Industry Co., Ltd. Printed circuit board
D639756, Jul 16 2010 DBG Group Investments, LLC Circuit board for integrated ozone laundry system
D642546, Jul 16 2010 DBG Group Investments, LLC Circuit board with LEDS for an integrated ozone laundry system
///////////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 15 2014NEC Engineering, Ltd.(assignment on the face of the patent)
Apr 15 2014NEC Corporation(assignment on the face of the patent)
Apr 16 2014MIYAMOTO, TAKAHIRONEC CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0327530695 pdf
Apr 16 2014UEDA, SUMIONEC CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0327530695 pdf
Apr 16 2014SASAKI, KIYOTAKENEC CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0327530695 pdf
Apr 16 2014SHIROYAMA, NORIHISANEC CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0327530695 pdf
Apr 16 2014MIYAMOTO, TAKAHIRONEC ENGINEERING, LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0327530695 pdf
Apr 16 2014UEDA, SUMIONEC ENGINEERING, LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0327530695 pdf
Apr 16 2014SASAKI, KIYOTAKENEC ENGINEERING, LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0327530695 pdf
Apr 16 2014SHIROYAMA, NORIHISANEC ENGINEERING, LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0327530695 pdf
Apr 01 2017NEC ENGINEERING CORPORATIONNEC PLATFORMS, LTDMERGER SEE DOCUMENT FOR DETAILS 0448820467 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule