|
The ornamental design for a bite size snack food, as shown and described. |
FIG. 1 is a top plan view of a snack food embodying my new design, the undisclosed bottom being a mirror image;
FIG. 2 is a side elevational view thereof, with the view of the other three sides being the same; and,
FIG. 3 is a top perspective view thereof.
Patent | Priority | Assignee | Title |
11197481, | Dec 14 2012 | Intercontinental Great Brands LLC | Biscuit with debossing on top and bottom |
11234443, | Dec 14 2012 | Intercontinental Great Brands, LLC | Biscuit with debossing on top and bottom |
D566060, | Apr 13 2005 | Nitto Denko Corporation | Grooves formed around a semiconductor device on a circuit board |
D577691, | Apr 13 2005 | Nitto Denko Corporation | Grooves formed around a semiconductor device on a circuit board |
D577692, | Apr 13 2005 | Nitto Denko Corporation | Grooves formed around a semiconductor device on a circuit board |
Patent | Priority | Assignee | Title |
D273582, | Sep 08 1981 | Holding pallet for PC boards | |
D288380, | Jul 23 1984 | General Foods Corporation | Cereal piece |
D319629, | Apr 13 1988 | IBIDEN CO , LTD , A JAPANESE CORP | Semiconductor substrate with conducting pattern |
95784, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |