FIG. 1 is a perspective view of an SSD storage device showing our new design.
FIG. 2 is a front elevation view thereof.
FIG. 3 is a rear elevation view thereof.
FIG. 4 is a left side elevation view thereof.
FIG. 5 is a right side elevation view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Broken lines and unshaded portions contained within broken lines depict either features of the SSD storage device that form no part of the present design claim or exemplary elements that might be used in conjunction with the SSD storage device that are shown for illustrative purposes only and that form no part of the claimed design.
| Patent |
Priority |
Assignee |
Title |
| 4872505, |
Aug 16 1988 |
TERADATA US, INC |
Heat sink for an electronic device |
| 5224023, |
Feb 10 1992 |
|
Foldable electronic assembly module |
| 5347428, |
Dec 03 1992 |
TALON RESEARCH, LLC |
Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip |
| 5754409, |
Nov 06 1996 |
DYNAMEM, INC |
Foldable electronic assembly module |
| 5995370, |
Sep 01 1997 |
Sharp Kabushiki Kaisha |
Heat-sinking arrangement for circuit elements |
| 6002589, |
Jul 21 1997 |
Rambus Inc |
Integrated circuit package for coupling to a printed circuit board |
| 6021048, |
Feb 17 1998 |
|
High speed memory module |
| 6025992, |
Feb 11 1999 |
GOOGLE LLC |
Integrated heat exchanger for memory module |
| 6088829, |
Oct 26 1995 |
Hitachi Maxell, Ltd |
Synchronous data transfer system |
| 6381140, |
Aug 30 1999 |
Witek Enterprise Co., Ltd. |
Memory module |
| 6535387, |
Jun 28 2001 |
Intel Corporation |
Heat transfer apparatus |
| 6590282, |
Apr 12 2002 |
Industrial Technology Research Institute |
Stacked semiconductor package formed on a substrate and method for fabrication |
| 6614664, |
Oct 24 2000 |
Samsung Electronics Co., Ltd. |
Memory module having series-connected printed circuit boards |
| 6628538, |
Mar 10 2000 |
Longitude Licensing Limited |
Memory module including module data wirings available as a memory access data bus |
| 6757751, |
Aug 11 2000 |
|
High-speed, multiple-bank, stacked, and PCB-mounted memory module |
| 6762942, |
Sep 05 2002 |
|
Break away, high speed, folded, jumperless electronic assembly |
| 6956284, |
Oct 26 2001 |
TAMIRAS PER PTE LTD , LLC |
Integrated circuit stacking system and method |
| 7269025, |
Dec 30 2004 |
TAHOE RESEARCH, LTD |
Ballout for buffer |
| 7299313, |
Oct 29 2004 |
International Business Machines Corporation |
System, method and storage medium for a memory subsystem command interface |
| 7516281, |
May 25 2004 |
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT |
On-die termination snooping for 2T applications in a memory system implementing non-self-terminating ODT schemes |
| 7590899, |
Sep 15 2006 |
International Business Machines Corporation |
Processor memory array having memory macros for relocatable store protect keys |
| 7619893, |
Feb 17 2006 |
NETLIST, INC |
Heat spreader for electronic modules |
| 7636274, |
Mar 05 2004 |
Netlist, Inc. |
Memory module with a circuit providing load isolation and memory domain translation |
| 7688592, |
Feb 23 2004 |
Infineon Technologies AG |
Cooling system for devices having power semiconductors and method for cooling the device |
| 7811097, |
Aug 29 2005 |
Netlist, Inc. |
Circuit with flexible portion |
| 7839712, |
Aug 03 2007 |
Polaris Innovations Limited |
Semiconductor memory arrangement |
| 7861029, |
Apr 23 2007 |
Polaris Innovations Limited |
Memory module having buffer and memory ranks addressable by respective selection signal |
| 8018723, |
Apr 30 2008 |
NETLIST, INC |
Heat dissipation for electronic modules |
| 8347057, |
Aug 27 2009 |
Longitude Licensing Limited |
Memory module |
| 8422263, |
Jun 05 2009 |
Longitude Licensing Limited |
Load reduced memory module and memory system including the same |
| 8510629, |
Oct 21 2009 |
Longitude Licensing Limited |
Memory module on which regular chips and error correction chips are mounted |
| 8705240, |
Dec 18 2007 |
GOOGLE LLC |
Embossed heat spreader |
| 8796830, |
Sep 01 2006 |
GOOGLE LLC |
Stackable low-profile lead frame package |
| 8885422, |
Jun 12 2009 |
Hewlett Packard Enterprise Development LP |
Hierarchical on-chip memory |
| 20040196682, |
|
|
|
| 20050082663, |
|
|
|
| 20060049500, |
|
|
|
| 20060049502, |
|
|
|
| 20060049513, |
|
|
|
| 20060050488, |
|
|
|
| 20060050489, |
|
|
|
| 20060050492, |
|
|
|
| 20060050498, |
|
|
|
| 20060050592, |
|
|
|
| 20060129888, |
|
|
|
| 20060171247, |
|
|
|
| 20060261449, |
|
|
|
| 20070011574, |
|
|
|
| 20070033490, |
|
|
|
| 20070139897, |
|
|
|
| 20070176286, |
|
|
|
| 20070212902, |
|
|
|
| 20070212906, |
|
|
|
| 20070212919, |
|
|
|
| 20070212920, |
|
|
|
| 20070223198, |
|
|
|
| 20070294889, |
|
|
|
| 20080094811, |
|
|
|
| 20080116571, |
|
|
|
| 20080123300, |
|
|
|
| 20080123303, |
|
|
|
| 20080137278, |
|
|
|
| 20090129026, |
|
|
|
| 20090268390, |
|
|
|
| 20100073860, |
|
|
|
| 20130219235, |
|
|
|
| 20160172016, |
|
|
|
| 20160334992, |
|
|
|
| 20170010639, |
|
|
|
| CN303719066, |
|
|
|
| D432096, |
Nov 24 1999 |
Samsung Electronics Co., Ltd. |
Semiconductor module |
| D637192, |
Oct 18 2010 |
Apple Inc. |
Electronic device |
| D637193, |
Nov 19 2010 |
Apple Inc |
Electronic device |
| D652041, |
Nov 19 2010 |
Apple Inc. |
Electronic device |
| D655296, |
Oct 18 2010 |
Apple Inc. |
Electronic device |
| D673922, |
Apr 21 2011 |
Kioxia Corporation |
Portion of a substrate for an electronic circuit |
| D686215, |
Nov 19 2010 |
Apple Inc. |
Electronic device |
| D716310, |
Jun 09 2012 |
Apple Inc |
Electronic device |
| D753073, |
Dec 30 2014 |
GN AUDIO A S |
Printed circuit board |
| D787456, |
Jan 14 2015 |
Kioxia Corporation |
Substrate for an electronic circuit |
| D787457, |
Jan 14 2015 |
Kioxia Corporation |
Substrate for an electronic circuit |
| D793973, |
Jan 14 2015 |
Kioxia Corporation |
Substrate for an electronic circuit |
| D794035, |
Jun 20 2016 |
V-COLOR TECHNOLOGY INC. |
Solid state drive |
| D798251, |
Nov 07 2016 |
Transcend Information, Inc. |
Printed circuit board of solid-state memory |
| JP1426165, |
|
|
|
| JP1426166, |
|
|
|
| JP1426167, |
|
|
|
| JP1426168, |
|
|
|
| JP1426169, |
|
|
|
| JP1436225, |
|
|
|
| JP1479370, |
|
|
|
| JP1520122, |
|
|
|
| JP1528484, |
|
|
|
| JP1600323, |
|
|
|
| KR300645777, |
|
|
|
| KR300680966, |
|
|
|
| KR300680971, |
|
|
|