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The ornamental design for a cover for memory chips on a circuit board, as shown and described.
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FIG. 1 is a top plan view of a cover for memory chips on a circuit board showing my new design;
FIG. 2 is an inside view of the top portion, of the cover for memory chips on a circuit board;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a cross-sectional view thereof, taken along 5—5 of FIG. 1;
FIG. 6 is a front elevational view thereof;
FIG. 7 is a rear elevational view thereof;
FIG. 8 is an end elevational view thereof, the top portion is shown separately for clarity of illustration, the opposite end is a mirror image;
FIG. 9 is an end elevational view thereof;
FIG. 10 is a top perspective view thereof, on a reduced scale; and,
FIG. 11 is a cross-sectional view thereof, taken on line 11—11 of FIG. 1.
The broken line drawings of a circuit board in FIGS. 1, 4-7 and 9-11 is for illustrative purposes only and forms no part of the claimed design.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 04 2002 | Celetronix, Inc. | (assignment on the face of the patent) | / | |||
Jan 08 2003 | PEDDLE, CHARLES I | CELETRON, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013707 | /0770 | |
Mar 21 2005 | CELETRONIX USA, INC | JABIL CIRCUIT, INC | PATENT COLLATERAL ASSIGNMENT AND SECURITY INTEREST | 016345 | /0981 |
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