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The ornamental design for a housing for a printed circuit board, substantially as shown and described. |
FIG. 1 is a front, top and left side perspective view of a housing for a printed circuit board showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side elevational view thereof; and
FIG. 6 is a right side elevational view thereof.
Murglin, Joseph G., Kirpluk, Kenneth R., Petras, John W.
Patent | Priority | Assignee | Title |
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Patent | Priority | Assignee | Title |
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 18 1985 | KIRKPLUK, KENNETH R | AT&T Teletype Corporation | ASSIGNMENT OF ASSIGNORS INTEREST | 004499 | /0671 | |
Dec 18 1985 | MURGLIN, JOSEPH G | AT&T Teletype Corporation | ASSIGNMENT OF ASSIGNORS INTEREST | 004499 | /0671 | |
Dec 18 1985 | PETRAS, JOHN W | AT&T Teletype Corporation | ASSIGNMENT OF ASSIGNORS INTEREST | 004499 | /0671 | |
Dec 23 1985 | AT&T Teletype Corporation | (assignment on the face of the patent) | / |
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