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The ornamental design for a housing for printed circuit boards, as shown and described. |
FIG. 1 is a top, left side and front perspective view of a housing for printed circuit boards showing my new design, the right side being a mirror image of the left side;
FIG. 2 is a top plan view thereof on a reduced scale, the bottom view being a mirror image;
FIG. 3 is a rear elevational view thereof on a reduced scale;
FIG. 4 is a top left side and front perspective view of a second embodiment of my design;
FIG. 5 is a top plan view thereof on a reduced scale, the bottom being a mirror image;
FIG. 6 is a rear elevational view thereon on a reduced scale; and
FIG. 7 is a sectional view on a greatly enlarged scale of the first embodiment taken along line 7--7 in FIG. 2, the second embodiment being similar thereto however including a spacer between the top and bottom sections.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 04 1981 | KORZIK JAMES L | PARADYNE CORPORATION, A CORP OF DE | ASSIGNMENT OF ASSIGNORS INTEREST | 003888 | /0316 | |
May 11 1981 | Paradyne Corporation | (assignment on the face of the patent) | / | |||
Jul 31 1996 | Lucent Technologies, INC | PARADYNE CORPORATION FORMERLY KNOWN AS AT&T PARADYNE CORPORATION | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008167 | /0408 | |
Jul 31 1996 | Paradyne Corporation | BANKAMERICA BUSINESS CREDIT, INC | SECURITY AGREEMENT | 008261 | /0384 |
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