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The ornamental design for an electronic equipment housing, as shown and described. |
FIG. 1 is a top perspective view of the electronic container housing showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a side elevational view thereof with the opposite side elevational view being a mirror image;
FIG. 5 is a front elevational view thereof; and
FIG. 6 is a rear elevational view thereof therefore.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 27 1988 | SERIO, DONALD L JR | SERCO MOLD INC , A CORP OF CA | ASSIGNMENT OF ASSIGNORS INTEREST | 004959 | /0641 | |
Oct 11 1988 | Serco Mold Inc. | (assignment on the face of the patent) | / |
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