The ornamental design for a leadframe for a four-pin light emitting diode device, as shown.
FIG. 1 is a perspective view of the lead frame for a four-pin light emitting diode device showing our new design.
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevation view thereof; and,
FIG. 7 is a right side elevation view thereof.
It will be understood that the dashed lines presented in the drawings represent optional features, some of which are described and represented in the different embodiments illustrated in the accompanying figures.
Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin material