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Patent
D690276
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Priority
Oct 03 2012
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Filed
Oct 03 2012
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Issued
Sep 24 2013
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Expiry
Sep 24 2027
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Assg.orig
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Entity
unknown
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6
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15
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n/a
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The ornamental design for an electromagnetic interference shield, as shown and described.
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FIG. 1 is an exploded side perspective view of an electromagnetic interference shield of the present invention;
FIG. 2 is a side perspective view of the electromagnetic interference shield;
FIG. 3 is a top view of the electromagnetic interference shield; and,
FIG. 4 is a bottom view of the electromagnetic interference shield.
The broken line showing in FIGS. 1 and 2 represents unclaimed subject matter and forms no part of the claimed design.
Chang, Jason, Shaw, Richard William, Gevehausen, Richard R, Chang, Li Tien, Lin, Aiken, Li, Chih Liang
| Patent |
Priority |
Assignee |
Title |
| 5838550, |
Aug 28 1997 |
Hewlett Packard Enterprise Development LP |
Grounding clip for shielded modular connector |
| 6008990, |
Nov 23 1998 |
|
Cartridge type CPU module cooling structure |
| 6346672, |
Jul 03 2000 |
|
Structure for preventing electromagnetic interference of central processing unit |
| 6566597, |
Jan 09 2001 |
Hon Hai Precision Ind. Co., Ltd. |
Shield assembly for computer enclosure and pressing machine for making it |
| 6661676, |
Aug 21 2002 |
Cameo Communications Inc |
Protective shielding assembly for electric facilities |
| 6671183, |
Jan 17 2002 |
Denso Corporation |
Electronic equipment having two circuit boards overlapping only partly |
| 6711019, |
Jun 29 2001 |
MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD |
Mounting fitting of heat sink and method of removing the same |
| 6776625, |
Dec 06 2002 |
Hon Hai Precision Ind. Co., Ltd. |
Land grid array connector assembly with reinforcement |
| 7005738, |
Jan 30 2001 |
Thermal Corp. |
Semiconductor package with lid heat spreader |
| 7170014, |
Jun 18 2005 |
Hon Hai Precision Industry Co., Ltd. |
Electromagnetic interference shield apparatus |
| 7436661, |
May 11 2005 |
Microsoft Technology Licensing, LLC |
Two-compartment AC adaptor |
| 7529092, |
Apr 15 2004 |
MAGNOLIA LICENSING LLC |
Electromagnetic interference shield and heat sink apparatus |
| 7697296, |
Jul 20 2007 |
LENOVO INTERNATIONAL LIMITED |
Method and apparatus for securing a microprocessor and heat sink using fewer mounting holes |
| 8059410, |
Apr 10 2009 |
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.; Foxconn Technology Co., Ltd. |
Heat dissipation device |
| D580376, |
Oct 12 2006 |
SEMI-PHOTONICS CO , LTD |
Lead frame for a four-pin light-emitting diode device |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Sep 26 2012 | SHAW, RICHARD WILLIAM | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 029072 | /0481 |
pdf |
| Sep 26 2012 | GEVESHAUSEN, RICHARD R | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 029072 | /0481 |
pdf |
| Sep 27 2012 | CHANG, LI-TIEN | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 029072 | /0481 |
pdf |
| Sep 27 2012 | LIN, AIKEN | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 029072 | /0481 |
pdf |
| Sep 27 2012 | CHANG, JASON | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 029072 | /0481 |
pdf |
| Sep 27 2012 | LI, CHIH LIANG | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 029072 | /0481 |
pdf |
| Oct 03 2012 | | Hewlett-Packard Development Company, L.P. | (assignment on the face of the patent) | | / |
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Maintenance Schedule |
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