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Patent
   D613702
Priority
Oct 12 2006
Filed
Mar 20 2007
Issued
Apr 13 2010
Expiry
Apr 13 2024

TERM.DISCL.
Inventors
Yen, Jui-K…
Assg.orig
SemiLEDS O…
Assg.curr
SEMILEDS O…
Entity
unknown
Referenced by
1
References
15
Maint.:
n/a
The ornamental design for a two-pin lead frame for a led device, as shown and described.

FIG. 1 is a perspective view of a two-pin lead frame for a LED device in accordance with one embodiment of the present invention.

FIG. 2 is a front view of the two-pin lead frame for a LED device of FIG. 1.

FIG. 3 is a rear view of the two-pin lead frame for a LED device of FIG. 1.

FIG. 4 is a top view of the two-pin lead frame for a LED device of FIG. 1.

FIG. 5 is a bottom view of the two-pin lead frame for a LED device of FIG. 1.

FIG. 6 is a left view of the two-pin lead frame for a LED device of FIG. 1; and,

FIG. 7 is a right view of the two-pin lead frame for a LED device of FIG. 1.
INVENTORS:

Yen, Jui-Kang, Chen, Yung-Wei

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
D814473, Jan 19 2016 Sony Corporation Memory card
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
5977626, Aug 12 1998 ACER INC Thermally and electrically enhanced PBGA package
6559379, Feb 24 1995 GE THERMOMETRICS, INC Pressure sensor with transducer mounted on a metal base
6569764, Aug 25 1999 Renesas Electronics Corporation Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin material
6891256, Oct 22 2001 Semiconductor Components Industries, LLC Thin, thermally enhanced flip chip in a leaded molded package
6943433, Mar 06 2002 Nichia Corporation Semiconductor device and manufacturing method for same
6999318, Jul 28 2003 Honeywell International Inc. Heatsinking electronic devices
7211882, Mar 22 2005 Harvatek Corporation LED package structure and method for making the same
7321161, Dec 19 2003 Lumileds LLC LED package assembly with datum reference feature
20030116769,
20050127483,
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D520965, Jan 10 2003 Citizen Electronics Co., Ltd. Light emitting diode for illuminating an object
D532383, Jun 08 2005 MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD Light emitting diode module
D536309, Dec 08 2004 Nichia Corporation Light emitting diode board
ASSIGNMENT RECORDS    Assignment records on the USPTO
///
Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 20 2007SemiLEDS Optoelectronics Co., Ltd.(assignment on the face of the patent)
Feb 02 2010YEN, JUI-KANGSEMILEDS OPTOELECTRONICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0239210428 pdf
Feb 02 2010CHEN, YUNG-WEISEMILEDS OPTOELECTRONICS CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0239210428 pdf
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