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I claim the ornamental design for a metal base design for surface mount device LED (lighting emitting diode), as shown and described.
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FIG. 1 is a 3D of top view of a metal base design for surface mount device LED showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a 3D of bottom view thereof; and,
FIG. 9 is a perspective view thereof in use.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.
Wang, Bily, Chuang, Jonnie, Huang, Hui-Yen, Lee, Heng-Yen
Patent | Priority | Assignee | Title |
D644190, | Sep 29 2010 | Kabushiki Kaisha Toshiba | Light-emitting diode |
D644191, | Sep 29 2010 | Kabushiki Kaisha Toshiba | Portion of a light-emitting diode |
D649942, | Sep 29 2010 | Kabushiki Kaisha Toshiba | Light-emitting diode |
D803795, | Aug 09 2016 | RSM ELECTRON POWER, INC | Surface mount device |
D803796, | Aug 09 2016 | RSM ELECTRON POWER, INC | Surface mount device |
D803797, | Aug 09 2016 | RSM ELECTRON POWER, INC | Surface mount device |
D803798, | Aug 09 2016 | RSM ELECTRON POWER, INC | Surface mount device |
D899384, | Nov 04 2019 | PUTCO, INC | Surface-mount device |
D920933, | Nov 04 2019 | Putco, Inc. | Surface-mount device |
Patent | Priority | Assignee | Title |
5369551, | Nov 08 1993 | Sawtek, Inc. | Surface mount stress relief interface system and method |
6300674, | Jun 19 2000 | Harvatek Corp. | Flat package for semiconductor diodes |
6422716, | Mar 16 2000 | BJB GMBH & CO KG | Modular led assembly |
6574254, | Feb 08 2002 | Harvatek Corp. | Laser diode package with heat sinking substrate |
D476959, | Jul 31 2002 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 01 2004 | WANG, BILY | Harvatek Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015892 | /0757 | |
Oct 01 2004 | CHUANG, JONNIE | Harvatek Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015892 | /0757 | |
Oct 01 2004 | LEE, HENG-YEN | Harvatek Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015892 | /0757 | |
Oct 01 2004 | HUANG, HUI-YEN | Harvatek Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015892 | /0757 | |
Oct 12 2004 | Harvatek Corporation | (assignment on the face of the patent) | / |
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