Patent
   D506187
Priority
Oct 12 2004
Filed
Oct 12 2004
Issued
Jun 14 2005
Expiry
Jun 14 2019
Assg.orig
Entity
unknown
9
5
n/a
I claim the ornamental design for a metal base design for surface mount device LED (lighting emitting diode), as shown and described.

FIG. 1 is a 3D of top view of a metal base design for surface mount device LED showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a 3D of bottom view thereof; and,

FIG. 9 is a perspective view thereof in use.

The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Wang, Bily, Chuang, Jonnie, Huang, Hui-Yen, Lee, Heng-Yen

Patent Priority Assignee Title
D644190, Sep 29 2010 Kabushiki Kaisha Toshiba Light-emitting diode
D644191, Sep 29 2010 Kabushiki Kaisha Toshiba Portion of a light-emitting diode
D649942, Sep 29 2010 Kabushiki Kaisha Toshiba Light-emitting diode
D803795, Aug 09 2016 RSM ELECTRON POWER, INC Surface mount device
D803796, Aug 09 2016 RSM ELECTRON POWER, INC Surface mount device
D803797, Aug 09 2016 RSM ELECTRON POWER, INC Surface mount device
D803798, Aug 09 2016 RSM ELECTRON POWER, INC Surface mount device
D899384, Nov 04 2019 PUTCO, INC Surface-mount device
D920933, Nov 04 2019 Putco, Inc. Surface-mount device
Patent Priority Assignee Title
5369551, Nov 08 1993 Sawtek, Inc. Surface mount stress relief interface system and method
6300674, Jun 19 2000 Harvatek Corp. Flat package for semiconductor diodes
6422716, Mar 16 2000 BJB GMBH & CO KG Modular led assembly
6574254, Feb 08 2002 Harvatek Corp. Laser diode package with heat sinking substrate
D476959, Jul 31 2002 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 01 2004WANG, BILYHarvatek CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0158920757 pdf
Oct 01 2004CHUANG, JONNIEHarvatek CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0158920757 pdf
Oct 01 2004LEE, HENG-YENHarvatek CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0158920757 pdf
Oct 01 2004HUANG, HUI-YENHarvatek CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0158920757 pdf
Oct 12 2004Harvatek Corporation(assignment on the face of the patent)
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