Patent
   D507544
Priority
Apr 25 2003
Filed
Apr 25 2003
Issued
Jul 19 2005
Expiry
Jul 19 2019
Assg.orig
Entity
unknown
4
8
n/a
The ornamental design for a light emitting diode package, as shown and described.

FIG. 1 is a top perspective view of the metal plates of the light emitting diode package, shown separately for ease of illustration;

FIG. 2 is a bottom perspective view of the metal plates of the light emitting diode package, shown separately for ease of illustration;

FIG. 3 is a top plan view of an alternate embodiment of the light emitting diode package showing a LED chip;

FIG. 4 is a rear perspective view of the light emitting diode wherein the metal plates are encapsulated;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a left side elevation view thereof;

FIG. 8 is a right side elevation view thereof; and,

FIG. 9 is a front perspective view thereof.

Wang, Bily, Chuang, Jonnie

Patent Priority Assignee Title
9497570, Feb 06 2014 NIMBELINK CORP Embedded wireless modem
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D899384, Nov 04 2019 PUTCO, INC Surface-mount device
D920933, Nov 04 2019 Putco, Inc. Surface-mount device
Patent Priority Assignee Title
4727457, Jan 24 1986 U S PHILIPS CORPORATION Surface-mounted optoelectronic device
5369551, Nov 08 1993 Sawtek, Inc. Surface mount stress relief interface system and method
6028351, Sep 30 1997 Texas Instruments Incorporated Gasket sealed integrated circuit package
6105226, May 16 1996 TRIQUINT, INC Leadless ceramic chip carrier crosstalk suppression method
6300674, Jun 19 2000 Harvatek Corp. Flat package for semiconductor diodes
6422716, Mar 16 2000 BJB GMBH & CO KG Modular led assembly
D476959, Jul 31 2002 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D499075, Jan 14 2004 SAMSUNG ELECTRONICS CO , LTD Light-emitting diode
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 15 2003WANG, BILYHARVATEK CORP ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0140190666 pdf
Apr 15 2003CHUANG, JONNIEHARVATEK CORP ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0140190666 pdf
Apr 25 2003Harvatek Corporation(assignment on the face of the patent)
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