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The ornamental design for a light emitting diode package, as shown and described.
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FIG. 1 is a top perspective view of the metal plates of the light emitting diode package, shown separately for ease of illustration;
FIG. 2 is a bottom perspective view of the metal plates of the light emitting diode package, shown separately for ease of illustration;
FIG. 3 is a top plan view of an alternate embodiment of the light emitting diode package showing a LED chip;
FIG. 4 is a rear perspective view of the light emitting diode wherein the metal plates are encapsulated;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a left side elevation view thereof;
FIG. 8 is a right side elevation view thereof; and,
FIG. 9 is a front perspective view thereof.
Patent | Priority | Assignee | Title |
9497570, | Feb 06 2014 | NIMBELINK CORP | Embedded wireless modem |
D731491, | Feb 07 2014 | NIMBELINK CORP | Embedded cellular modem |
D899384, | Nov 04 2019 | PUTCO, INC | Surface-mount device |
D920933, | Nov 04 2019 | Putco, Inc. | Surface-mount device |
Patent | Priority | Assignee | Title |
4727457, | Jan 24 1986 | U S PHILIPS CORPORATION | Surface-mounted optoelectronic device |
5369551, | Nov 08 1993 | Sawtek, Inc. | Surface mount stress relief interface system and method |
6028351, | Sep 30 1997 | Texas Instruments Incorporated | Gasket sealed integrated circuit package |
6105226, | May 16 1996 | TRIQUINT, INC | Leadless ceramic chip carrier crosstalk suppression method |
6300674, | Jun 19 2000 | Harvatek Corp. | Flat package for semiconductor diodes |
6422716, | Mar 16 2000 | BJB GMBH & CO KG | Modular led assembly |
D476959, | Jul 31 2002 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
D499075, | Jan 14 2004 | SAMSUNG ELECTRONICS CO , LTD | Light-emitting diode |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 15 2003 | WANG, BILY | HARVATEK CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014019 | /0666 | |
Apr 15 2003 | CHUANG, JONNIE | HARVATEK CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014019 | /0666 | |
Apr 25 2003 | Harvatek Corporation | (assignment on the face of the patent) | / |
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