Patent
   D509809
Priority
Aug 10 2004
Filed
Aug 10 2004
Issued
Sep 20 2005
Expiry
Sep 20 2019
Assg.orig
Entity
unknown
10
5
n/a
The ornamental design for a metal base design for surface mount device LED, as shown and described.

FIG. 1 is a top 3D view of a metal base design for surface mount device LED showing my new design:

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a bottom 3D view thereof; and,

FIG. 9 is a view after packing with chip and wiring thereof.

The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Wang, Bily, Chuang, Jonnie, Huang, Hui Yen

Patent Priority Assignee Title
D644190, Sep 29 2010 Kabushiki Kaisha Toshiba Light-emitting diode
D644191, Sep 29 2010 Kabushiki Kaisha Toshiba Portion of a light-emitting diode
D649942, Sep 29 2010 Kabushiki Kaisha Toshiba Light-emitting diode
D803795, Aug 09 2016 RSM ELECTRON POWER, INC Surface mount device
D803796, Aug 09 2016 RSM ELECTRON POWER, INC Surface mount device
D803797, Aug 09 2016 RSM ELECTRON POWER, INC Surface mount device
D803798, Aug 09 2016 RSM ELECTRON POWER, INC Surface mount device
D899384, Nov 04 2019 PUTCO, INC Surface-mount device
D920933, Nov 04 2019 Putco, Inc. Surface-mount device
D974877, Apr 30 2020 Draper, Inc. Electronic display mount
Patent Priority Assignee Title
5369551, Nov 08 1993 Sawtek, Inc. Surface mount stress relief interface system and method
6300674, Jun 19 2000 Harvatek Corp. Flat package for semiconductor diodes
6422716, Mar 16 2000 BJB GMBH & CO KG Modular led assembly
6574254, Feb 08 2002 Harvatek Corp. Laser diode package with heat sinking substrate
D476959, Jul 31 2002 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 28 2004WANG, BILYHarvatek CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0156770912 pdf
Jul 28 2004CHUANG, JONNIEHarvatek CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0156770912 pdf
Jul 28 2004HUANG, HUI YENHarvatek CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0156770912 pdf
Aug 10 2004Harvatek Corporation(assignment on the face of the patent)
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