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The ornamental design for a metal base design for surface mount device LED, as shown and described.
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FIG. 1 is a top 3D view of a metal base design for surface mount device LED showing my new design:
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a bottom 3D view thereof; and,
FIG. 9 is a view after packing with chip and wiring thereof.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.
Wang, Bily, Chuang, Jonnie, Huang, Hui Yen
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 28 2004 | WANG, BILY | Harvatek Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015677 | /0912 | |
Jul 28 2004 | CHUANG, JONNIE | Harvatek Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015677 | /0912 | |
Jul 28 2004 | HUANG, HUI YEN | Harvatek Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015677 | /0912 | |
Aug 10 2004 | Harvatek Corporation | (assignment on the face of the patent) | / |
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