Patent
   D507246
Priority
Apr 10 2003
Filed
Apr 10 2003
Issued
Jul 12 2005
Expiry
Jul 12 2019
Assg.orig
Entity
unknown
0
8
n/a
The ornamental design for a light emitting diode package, as shown and described.

FIG. 1 is a top perspective view of the coplanar metal plates of the light emitting diode package, shown separately for ease of illustration;

FIG. 2 is a bottom perspective view of the coplanar metal plates of the light emitting diode package, shown separately for ease of illustration;

FIG. 3 is a top plan view of the light emitting diode package wherein the coplanar metal plates are embedded;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a left side elevation view thereof;

FIG. 6 is a right side elevation view thereof;

FIG. 7 is a front side elevation view thereof; and,

FIG. 8 is a back side elevation view thereof.

Wang, Bily, Chuang, Jonnie

Patent Priority Assignee Title
Patent Priority Assignee Title
4727457, Jan 24 1986 U S PHILIPS CORPORATION Surface-mounted optoelectronic device
5369551, Nov 08 1993 Sawtek, Inc. Surface mount stress relief interface system and method
6028351, Sep 30 1997 Texas Instruments Incorporated Gasket sealed integrated circuit package
6105226, May 16 1996 TRIQUINT, INC Leadless ceramic chip carrier crosstalk suppression method
6300674, Jun 19 2000 Harvatek Corp. Flat package for semiconductor diodes
6422716, Mar 16 2000 BJB GMBH & CO KG Modular led assembly
D476959, Jul 31 2002 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
D499075, Jan 14 2004 SAMSUNG ELECTRONICS CO , LTD Light-emitting diode
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 27 2003WANG, BILYHarvatek CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0139550263 pdf
Feb 27 2003CHUANG, JONNIEHarvatek CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0139550263 pdf
Apr 10 2003Harvatek Corporation(assignment on the face of the patent)
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