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The ornamental design for a light emitting diode package, as shown and described.
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FIG. 1 is a top perspective view of the coplanar metal plates of the light emitting diode package, shown separately for ease of illustration;
FIG. 2 is a bottom perspective view of the coplanar metal plates of the light emitting diode package, shown separately for ease of illustration;
FIG. 3 is a top plan view of the light emitting diode package wherein the coplanar metal plates are embedded;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a right side elevation view thereof;
FIG. 7 is a front side elevation view thereof; and,
FIG. 8 is a back side elevation view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 27 2003 | WANG, BILY | Harvatek Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013955 | /0263 | |
Feb 27 2003 | CHUANG, JONNIE | Harvatek Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013955 | /0263 | |
Apr 10 2003 | Harvatek Corporation | (assignment on the face of the patent) | / |
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