Patent
   D836073
Priority
Jan 25 2017
Filed
Jan 25 2017
Issued
Dec 18 2018
Expiry
Dec 18 2033
Assg.orig
Entity
unknown
0
15
n/a
The ornamental design for a solid state relay, as shown and described.

FIG. 1 is a front, top, left-side perspective view of the solid state relay;

FIG. 2 is a front elevational view thereof, the rear elevational view (not provided) being a mirror image thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a right-side elevational view thereof, the left-side elevational view (not provided) being a mirror image thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a rear, bottom, left-side perspective view thereof.

The broken lines depict portions of the solid state relay that form no part of the claimed design.

Sasaki, Mitsumasa

Patent Priority Assignee Title
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D717253, Oct 11 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
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Jan 04 2017SASAKI, MITSUMASASHINDENGEN ELECTRIC MANUFACTURING CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0410810592 pdf
Jan 25 2017Shindengen Electric Manufacturing Co., Ltd.(assignment on the face of the patent)
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