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Patent
D836073
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Priority
Jan 25 2017
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Filed
Jan 25 2017
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Issued
Dec 18 2018
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Expiry
Dec 18 2033
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Assg.orig
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Entity
unknown
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0
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15
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n/a
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The ornamental design for a solid state relay, as shown and described.
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FIG. 1 is a front, top, left-side perspective view of the solid state relay;
FIG. 2 is a front elevational view thereof, the rear elevational view (not provided) being a mirror image thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a right-side elevational view thereof, the left-side elevational view (not provided) being a mirror image thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a rear, bottom, left-side perspective view thereof.
The broken lines depict portions of the solid state relay that form no part of the claimed design.
Sasaki, Mitsumasa
Patent |
Priority |
Assignee |
Title |
Patent |
Priority |
Assignee |
Title |
4361371, |
Dec 08 1980 |
POTTER & BRUMFIELD, INC |
Packaging of solid state relay |
5229739, |
Feb 21 1992 |
Littelfuse, Inc. |
Automotive high current fuse |
20050194552, |
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20080128889, |
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20180160569, |
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D305642, |
Oct 06 1986 |
Satori Switch Industry Co., Ltd. |
Electrical switch assembly |
D357462, |
Sep 16 1993 |
Fuji Electric Co., Ltd. |
Hybrid integrated circuit for electric power control |
D518792, |
Apr 08 2005 |
PACIFIC ENGINEERING CORP |
Fuse |
D539761, |
Aug 22 2006 |
Kabushiki Kaisha Toshiba |
Semiconductor |
D548203, |
Apr 17 2006 |
Kabushiki Kaisha Toshiba |
Semiconductor |
D717253, |
Oct 11 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D719926, |
Sep 20 2012 |
SAMSUNG ELECTRO-MECHANICS CO , LTD |
Semiconductor device |
D770994, |
Apr 02 2014 |
Mitsubishi Electric Corporation |
Power semiconductor device |
JP1587425, |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a