Patent
   D836565
Priority
Jan 25 2017
Filed
Mar 15 2018
Issued
Dec 25 2018
Expiry
Dec 25 2033
Assg.orig
Entity
unknown
0
14
n/a
The ornamental design for a solid state relay, as shown and described.

FIG. 1 is a front, top, left-side perspective view of the solid state relay;

FIG. 2 is a front elevational view thereof, the rear elevational view (not provided) being a mirror image thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a right-side elevational view thereof, the left-side elevational view (not provided) being a mirror image thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a rear, bottom, left-side perspective view thereof.

The broken lines in the drawings illustrate portions of the solid state relay that form no part of the claimed design.

Sasaki, Mitsumasa

Patent Priority Assignee Title
Patent Priority Assignee Title
4361371, Dec 08 1980 POTTER & BRUMFIELD, INC Packaging of solid state relay
5229739, Feb 21 1992 Littelfuse, Inc. Automotive high current fuse
20050194552,
20080128889,
20130286594,
20180160569,
D357462, Sep 16 1993 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
D518792, Apr 08 2005 PACIFIC ENGINEERING CORP Fuse
D539761, Aug 22 2006 Kabushiki Kaisha Toshiba Semiconductor
D548203, Apr 17 2006 Kabushiki Kaisha Toshiba Semiconductor
D717253, Oct 11 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D719926, Sep 20 2012 SAMSUNG ELECTRO-MECHANICS CO , LTD Semiconductor device
D770994, Apr 02 2014 Mitsubishi Electric Corporation Power semiconductor device
JP1587425,
/
Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 15 2018Shindengen Electric Manufacturing Co., Ltd.(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule