Patent
   D568836
Priority
Apr 13 2005
Filed
Oct 11 2005
Issued
May 13 2008
Expiry
May 13 2022
Assg.orig
Entity
unknown
5
13
n/a
The ornamental design for a groove formed around a semiconductor device on a circuit board, as shown and described.

FIG. 1 is a plan view of the groove formed around a semiconductor device on a circuit board showing our new design;

FIG. 2 is an enlarged view of the area boxed by the dash-dot-dash line in FIG. 1; and,

FIG. 3 is a sectional view taken along line 33 in FIG. 2.

The broken lines represent unclaimed subject matter.

Ohsawa, Tetsuya, Tani, Emiko

Patent Priority Assignee Title
D580895, May 01 2006 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
D584249, May 01 2006 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
D584250, May 01 2006 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
D585394, Apr 13 2005 Nitto Denko Corporation Groove formed around a semiconductor device on a circuit board
D877739, Sep 15 2017 uQontrol, Inc. Smartcard with Q-shaped contact pad
Patent Priority Assignee Title
5420558, May 27 1992 FUJI ELECTRIC CO , LTD Thin film transformer
5467252, Oct 18 1993 Motorola, Inc. Method for plating using nested plating buses and semiconductor device having the same
5777277, Sep 21 1995 Canon Kabushiki Kaisha Printed circuit board
5969590, Aug 05 1997 MACOM CONNECTIVITY SOLUTIONS, LLC Integrated circuit transformer with inductor-substrate isolation
6114937, Aug 23 1996 International Business Machines Corporation Integrated circuit spiral inductor
6121552, Jun 13 1997 CALIFORNIA, UNIVERSITY OF, REGENTS OF THE, THE Microfabricated high aspect ratio device with an electrical isolation trench
6486412, Sep 13 2000 BOE TECHNOLOGY GROUP CO , LTD Wiring board, method for producing same, display device, and electronic device
7126452, Nov 14 2003 Canon Kabushiki Kaisha Wiring structure, and fabrication method of the same
20060266545,
20070188287,
20070205856,
D319629, Apr 13 1988 IBIDEN CO , LTD , A JAPANESE CORP Semiconductor substrate with conducting pattern
JP118275,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 28 2005OHSAWA, TETSUYANitto Denko CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0171060334 pdf
Sep 28 2005TANI, EMIKONitto Denko CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0171060334 pdf
Oct 11 2005Nitto Denko Corporation(assignment on the face of the patent)
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