Groove formed around a semiconductor device on a circuit board

The ornamental design for a groove formed around a semiconductor device on a circuit board, as shown and described.

FIG. 1 is a plan view of the groove formed around a semiconductor device on a circuit board showing our new design;

FIG. 2 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1; and,

FIG. 3 shows an enlarged sectional view along the line 3—3 in FIG. 2.

The broken lines represent unclaimed subject matter.

Patent	Priority	Assignee	Title
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Executed on	Assignor	Assignee	Conveyance	Frame	Reel	Doc
Apr 07 2008		Nitto Denko Corporation	(assignment on the face of the patent)

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