Grooves formed around a semiconductor device on a circuit board

The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.

FIG. 1 shows a plan view of the grooves formed around a semiconductor device on a circuit board showing the design according to the invention.

FIG. 2 shows an enlarged view of a claimed portion as identified by the area boxed by the dash-dot-dash line in FIG. 1.

FIG. 3 shows an enlarged sectional view along the line 3—3 in FIG. 2; and,

FIG. 4 shows an enlarged sectional view along the line 4—4 in FIG. 2.

The elements shown in broken lines and dash-dot-dash lines are for illustrative purposes only and form no part of the claimed invention.

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Executed on	Assignor	Assignee	Conveyance	Frame	Reel	Doc
Feb 15 2008		Nitto Denko Corporation	(assignment on the face of the patent)

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