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Patent
D621803
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Priority
Jul 16 2008
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Filed
Jul 16 2008
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Issued
Aug 17 2010
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Expiry
Aug 17 2024
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Assg.orig
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Entity
unknown
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31
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9
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n/a
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The ornamental design for a “semiconductor wafer processing tape,” as shown and described.
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FIG. 1 is a perspective view showing our new design;
FIG. 2 is a top plan view;
FIG. 3 is a bottom plan view;
FIG. 4 is a left side view;
FIG. 5 is a front side view;
FIG. 6 is a right side view;
FIG. 7 is a cross sectional view at 7—7 of FIG. 1; and,
FIG. 8 is a cross sectional view at 8—8 of FIG. 1.
Maruyama, Hiromitsu, Taguchi, Shuzo, Morishima, Yasumasa, Ishiwata, Shinichi
Patent |
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9523023, |
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FURUKAWA ELECTRIC CO., LTD. |
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9599927, |
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9631123, |
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FURUKAWA ELECTRIC CO., LTD. |
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9989887, |
Jun 11 2010 |
Ricoh Company, Ltd. |
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D656909, |
Oct 15 2010 |
Resonac Corporation |
Adhesive tape for semiconductor manufacturing |
D656910, |
Oct 15 2010 |
Resonac Corporation |
Adhesive tape for semiconductor manufacturing |
D664511, |
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Resonac Corporation |
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SHOWA DENKO MATERIALS CO , LTD |
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D962883, |
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ER3550, |
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ER5187, |
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ER7356, |
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ER791, |
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Patent |
Priority |
Assignee |
Title |
6864295, |
Jul 23 2002 |
Asahi Kasei Chemicals Corporation |
Gas-generating, pressure-sensitive adhesive composition |
20070241436, |
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20100080989, |
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D589473, |
May 30 2007 |
Nitto Denko Corporation |
Adhesive film material for use in manufacturing semiconductors |
D598380, |
May 09 2008 |
FUJIFILM Corporation |
Conductive sheet |
JP1267623, |
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JP1315406, |
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JP1315621, |
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JP20072173, |
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a