Adhesive film material for use in manufacturing semiconductors

Abstract

Description

FIG. 1 is a perspective view of a first embodiment of the adhesive film material for use in manufacturing semiconductors showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a plan view thereof;

FIG. 4 is a right side view, the left side being a mirror image thereof;

FIG. 5 is an enlarged plan view of the design as identified by A and B in FIG. 2;

FIG. 6 is a sectional view taken along line 6—6 in FIG. 5;

FIG. 7 is a sectional view taken along line 7—7 in FIG. 5;

FIG. 8 is a perspective view of a second embodiment of the adhesive film material for use in manufacturing semiconductors;

FIG. 9 is a front view thereof;

FIG. 10 is a plan view thereof;

FIG. 11 is a right side view, the left side being a mirror image thereof;

FIG. 12 is an enlarged plan view of the design as identified by A and B in FIG. 9;

FIG. 13 is a sectional view taken along line 13—13 in FIG. 12;

FIG. 14 is a sectional view taken along line 14—14 in FIG. 12;

FIG. 15 is a perspective view of a third embodiment of the adhesive film material for use in manufacturing semiconductors;

FIG. 16 is a front view thereof;

FIG. 17 is a plan view thereof;

FIG. 18 is a right side view, the left side being a mirror image thereof;

FIG. 19 is an enlarged plan view of the design as identified by A and B in FIG. 16;

FIG. 20 is a sectional view taken along line 20—20 in FIG. 19; and,

FIG. 21 is a sectional view taken along line 21—21 in FIG. 19.

Claims

The ornamental design for adhesive film material for use in manufacturing semiconductors, as shown and described.