FIG. 1 is a front, right, and top perspective view of a semiconductor substrate showing our new design;
FIG. 2 is a front view thereof, a rear view being a mirror image thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right-side view thereof, a left side view being a mirror image thereof;
FIG. 6 is a partially enlarged view at 6 shown in FIG. 2 thereof;
FIG. 7 is a partially enlarged view at 7 shown in FIG. 2 thereof;
FIG. 8 is an enlarged cross sectional view at 8-8 shown in FIG. 3 thereof; and,
FIG. 9 is a partially enlarged sectional view at 9 shown in FIG. 8 thereof.
The broken line showing of the semiconductor substrate is for the purpose of illustrating environmental structure and forms no part of the claimed design.
Sasaki, Makoto, Nishiguchi, Taro, Harada, Shin, Fujiwara, Shinsuke, Namikawa, Yasuo
Patent |
Priority |
Assignee |
Title |
11333677, |
Jul 23 2018 |
CACI, Inc.—Federal |
Methods and apparatuses for detecting tamper using heuristic models |
11662698, |
Jul 23 2018 |
CACI, Inc.—Federal |
Methods and apparatuses for detecting tamper using machine learning models |
11747775, |
Jul 23 2018 |
CACI, Inc.—Federal |
Integrated tamper detection system and methods |
D690672, |
Oct 04 2011 |
Kabushiki Kaisha Yaskawa Denki |
Encoder optical module |
D699201, |
Oct 01 2012 |
TELIT CINTERION DEUTSCHLAND GMBH |
Pad arrangement of a circuit module |
D700440, |
Oct 14 2011 |
Under Armour, Inc.; Under Armour, Inc |
Camouflage pattern |
D700441, |
Oct 14 2011 |
Under Armour, Inc.; Under Armour, Inc |
Camouflage pattern |
D720313, |
Jun 16 2014 |
SOLAERO TECHNOLOGIES CORP |
Semiconductor wafer with dicing positions for solar cell fabrication |
D769832, |
Feb 19 2013 |
Sony Corporation |
Semiconductor device |
D784937, |
Nov 13 2014 |
Tokyo Electron Limited |
Dummy wafer |
D785576, |
Nov 13 2014 |
Tokyo Electron Limited |
Dummy wafer |
D786810, |
Nov 13 2014 |
Tokyo Electron Limited |
Dummy wafer |
D789311, |
Dec 28 2015 |
KOKUSAI ELECTRIC CORPORATION |
Pattern wafer |
D791091, |
Dec 28 2015 |
KOKUSAI ELECTRIC CORPORATION |
Pattern wafer |
D806249, |
Dec 16 2014 |
HAMAMATSU PHOTONICS K K |
Radiation image conversion plate |
D808664, |
May 16 2016 |
Ninja Brand Incorporated |
Sheet with camouflage pattern |
D839220, |
Feb 19 2013 |
Sony Corporation |
Semiconductor device |
D846513, |
Apr 27 2016 |
NGK Insulators, Ltd. |
Sheet heater for electrostatic chuck |
D852958, |
Dec 16 2014 |
Hamamatsu Photonics K.K. |
Radiation image conversion plate |
D947800, |
Jul 16 2019 |
CACI, Inc.—Federal |
Integrated module |
Patent |
Priority |
Assignee |
Title |
4630093, |
Nov 24 1983 |
Sumitomo Electric Industries, Ltd. |
Wafer of semiconductors |
5182233, |
Aug 02 1989 |
Kabushiki Kaisha Toshiba |
Compound semiconductor pellet, and method for dicing compound semiconductor wafer |
6927416, |
Dec 26 2002 |
Disco Corporation |
Wafer support plate |
7112952, |
Jan 30 2004 |
Semiconductor Energy Laboratory Co., Ltd. |
Inspection system, inspection method, and method for manufacturing semiconductor device |
7205639, |
Mar 09 2005 |
Infineon Technologies AG |
Semiconductor devices with rotated substrates and methods of manufacture thereof |
7476575, |
Jun 24 2004 |
SEMICONDUCTOR ENERGY LABORATORY CO , LTD |
Method for manufacturing thin film integrated circuit |
7705430, |
Apr 27 2005 |
Disco Corporation |
Semiconductor wafer and processing method for same |
20050106839, |
|
|
|
20050287846, |
|
|
|
20060038182, |
|
|
|
20060091402, |
|
|
|
20070082508, |
|
|
|
20090011598, |
|
|
|
20100176403, |
|
|
|
20110111593, |
|
|
|
217594, |
|
|
|
D262962, |
Nov 03 1978 |
|
Silicon wafer emitter electrode configuration |
D589473, |
May 30 2007 |
Nitto Denko Corporation |
Adhesive film material for use in manufacturing semiconductors |
D614593, |
Jul 21 2008 |
ASM KOREA LTD |
Substrate support for a semiconductor deposition apparatus |
D638382, |
Apr 09 2010 |
SAMSUNG DISPLAY CO , LTD |
Electroluminescence module |
JP200368592, |
|
|
|
JP2005260154, |
|
|
|
JP832038, |
|
|
|
//////
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 18 2010 | NISHIGUCHI, TARO | SUMITOMO ELECTRIC INDUSTRIES, LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 025409 | 0915 |
pdf |
Oct 18 2010 | SASAKI, MAKOTO | SUMITOMO ELECTRIC INDUSTRIES, LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 025409 | 0915 |
pdf |
Oct 18 2010 | FUJIWARA, SHINSUKE | SUMITOMO ELECTRIC INDUSTRIES, LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 025409 | 0915 |
pdf |
Oct 19 2010 | HARADA, SHIN | SUMITOMO ELECTRIC INDUSTRIES, LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 025409 | 0915 |
pdf |
Oct 25 2010 | NAMIKAWA, YASUO | SUMITOMO ELECTRIC INDUSTRIES, LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 025409 | 0915 |
pdf |
Nov 19 2010 | | Sumitomo Electric Industries, Ltd. | (assignment on the face of the patent) | | |
n/a
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |