PTO
Wrapper
PDF
|
Dossier
Espace
Google
|
|
Patent
D720313
|
Priority
Jun 16 2014
|
Filed
Jun 16 2014
|
Issued
Dec 30 2014
|
Expiry
Dec 30 2028
|
|
Assg.orig
|
|
Entity
unknown
|
25
|
23
|
n/a
|
|
|
The ornamental design for a semiconductor wafer with dicing positions for solar cell fabrication, as shown and described.
|
FIG. 1 is a top perspective view of a semiconductor wafer with dicing positions for a solar cell fabrication showing our new design;
FIG. 2 is a front side elevation view thereof;
FIG. 3 is a rear side elevation view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevation view thereof; and,
FIG. 7 is a right side elevation view thereof.
Richards, Benjamin C., Flynn, Greg
Patent |
Priority |
Assignee |
Title |
10208884, |
Jan 30 2014 |
DRAINGARDE, INC |
Watershed protection device and system |
D760180, |
Feb 21 2014 |
HZO, INC |
Hexcell channel arrangement for use in a boat for a deposition apparatus |
D778247, |
Apr 16 2015 |
Veeco Instruments Inc.; VEECO INSTRUMENTS, INC |
Wafer carrier with a multi-pocket configuration |
D784937, |
Nov 13 2014 |
Tokyo Electron Limited |
Dummy wafer |
D785576, |
Nov 13 2014 |
Tokyo Electron Limited |
Dummy wafer |
D786810, |
Nov 13 2014 |
Tokyo Electron Limited |
Dummy wafer |
D789311, |
Dec 28 2015 |
KOKUSAI ELECTRIC CORPORATION |
Pattern wafer |
D791091, |
Dec 28 2015 |
KOKUSAI ELECTRIC CORPORATION |
Pattern wafer |
D792962, |
Nov 28 2014 |
DRAINGARDE INC. |
Catch basin cover |
D793971, |
Mar 27 2015 |
Veeco Instruments INC |
Wafer carrier with a 14-pocket configuration |
D793972, |
Mar 27 2015 |
Veeco Instruments INC |
Wafer carrier with a 31-pocket configuration |
D806046, |
Apr 16 2015 |
Veeco Instruments Inc. |
Wafer carrier with a multi-pocket configuration |
D809804, |
Dec 17 2014 |
NGK Insulators, Ltd. |
Composite substrate for acoustic wave device |
D832206, |
Oct 31 2017 |
|
Solar pool cover |
D849422, |
Jun 09 2015 |
NGK Insulators, Ltd. |
Composite substrate for acoustic wave device |
D852762, |
Mar 27 2015 |
Veeco Instruments Inc. |
Wafer carrier with a 14-pocket configuration |
D897944, |
Jan 29 2019 |
|
Solar pool cover |
D897974, |
Mar 29 2018 |
HAMAMATSU PHOTONICS K K |
Semiconductor wafer |
D903583, |
Jan 29 2019 |
|
Solar pool cover |
D924790, |
Jan 29 2019 |
|
Solar pool cover |
D989012, |
Sep 17 2020 |
Ebara Corporation |
Elastic membrane |
ER4518, |
|
|
|
ER6966, |
|
|
|
ER8850, |
|
|
|
ER8863, |
|
|
|
Patent |
Priority |
Assignee |
Title |
5314844, |
Mar 04 1991 |
Kabushiki Kaisha Toshiba |
Method for dicing a semiconductor wafer |
8389320, |
Mar 20 2007 |
SANYO ELECTRIC CO , LTD |
Method for fracturing semiconductor substrate, method for fracturing solar cell, and the solar cell |
8513047, |
Mar 20 2007 |
Sanyo Electric Co., Ltd. |
Method for fracturing semiconductor substrate, method for fracturing solar cell, and the solar cell |
8530263, |
Aug 10 2011 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Superstrate solar cell |
8551864, |
Mar 25 2011 |
Sumitomo Electric Industries, Ltd. |
Method of manufacturing semiconductor device |
8555492, |
Dec 30 2009 |
Harvatek Corporation |
Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach |
8558371, |
Mar 23 2010 |
Samsung Electronics Co., Ltd. |
Method for wafer level package and semiconductor device fabricated using the same |
8754538, |
Jun 24 2008 |
Infineon Technologies AG |
Semiconductor chip including identifying marks |
8772137, |
May 08 2007 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Semiconductor wafer with assisting dicing structure and dicing method thereof |
8778723, |
Sep 20 2009 |
OC3 AG |
Serial connection of thin-layer solar cells |
8815715, |
Oct 30 2006 |
Infineon Technologies Americas Corp |
III-nitride wafer fabrication |
8828306, |
Nov 30 2007 |
HAMAMATSU PHOTONICS K K |
Working object cutting method |
8865567, |
Sep 22 2010 |
FUJI ELECTRIC CO , LTD |
Method of manufacturing semiconductor device |
8871612, |
Feb 16 2012 |
SUZHOU LEKIN SEMICONDUCTOR CO , LTD |
Method for forming a cleaved facet of semiconductor device |
D544452, |
Sep 08 2005 |
BISSEL INC ; BISSELL INC |
Supporting plate |
D549189, |
Sep 21 2004 |
Nitto Denko Corporation |
Dicing die-bonding film |
D552565, |
Sep 08 2005 |
TOKYO OHKA KOGYO CO , LTD |
Supporting plate |
D651991, |
Aug 17 2010 |
Sumitomo Electric Industries, Ltd. |
Semiconductor substrate |
D651992, |
Aug 17 2010 |
Sumitomo Electric Industries, Ltd. |
Semiconductor substrate |
D655256, |
Aug 17 2010 |
Sumitomo Electric Industries, Ltd. |
Semiconductor substrate |
D674759, |
Aug 19 2010 |
EPISTAR CORPORATION |
Wafer carrier |
D684551, |
Jul 07 2011 |
|
Wafer polishing pad holder |
D704155, |
Feb 18 2011 |
EPISTAR CORPORATION |
Wafer carrier |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jun 13 2014 | FLYNN, GREG | EMCORE SOLAR POWER, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 033330 | /0703 |
pdf |
Jun 13 2014 | RICHARDS, BENJAMIN C | EMCORE SOLAR POWER, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 033330 | /0703 |
pdf |
Jun 16 2014 | | Emcore Solar Power, Inc. | (assignment on the face of the patent) | | / |
Dec 10 2014 | EMCORE SOLAR POWER, INC | CITIZENS BANK OF PENNSYLVANIA, AS ADMINISTRATIVE AGENT | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 034612 | /0961 |
pdf |
Dec 10 2014 | WELLS FARGO BANK, N A | EMCORE SOLAR POWER, INC | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 034590 | /0761 |
pdf |
Jan 08 2015 | EMCORE SOLAR POWER, INC | SOLAERO TECHNOLOGIES CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 034750 | /0211 |
pdf |
Oct 16 2018 | SOLAERO TECHNOLOGIES CORP | CITIZENS BANK OF PENNSYLVANIA, AS ADMINISTRATIVE AGENT FOR THE SECURED PARTIES | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 047246 | /0418 |
pdf |
Apr 12 2019 | SOLAERO TECHNOLOGIES CORP | CITIZENS BANK, N A , AS ADMINISTRATIVE AGENT | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 048930 | /0952 |
pdf |
Apr 12 2019 | CITIZENS BANK, N A SUCCESSOR BY MERGER TO CITIZENS BANK OF PENNSYLVANIA , AS ADMINISTRATIVE AGENT | SOLAERO TECHNOLOGIES CORP | NOTICE OF RELEASE OF SECURITY INTEREST IN PATENTS | 048877 | /0802 |
pdf |
Apr 12 2019 | CITIZENS BANK, N A SUCCESSOR BY MERGER TO CITIZENS BANK OF PENNSYLVANIA , AS ADMINISTRATIVE AGENT | SOLAERO SOLAR POWER INC F K A EMCORE SOLAR POWER, INC | NOTICE OF RELEASE OF SECURITY INTEREST IN PATENTS | 049455 | /0179 |
pdf |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a