Patent
   D720313
Priority
Jun 16 2014
Filed
Jun 16 2014
Issued
Dec 30 2014
Expiry
Dec 30 2028
Assg.orig
Entity
unknown
25
23
n/a
The ornamental design for a semiconductor wafer with dicing positions for solar cell fabrication, as shown and described.

FIG. 1 is a top perspective view of a semiconductor wafer with dicing positions for a solar cell fabrication showing our new design;

FIG. 2 is a front side elevation view thereof;

FIG. 3 is a rear side elevation view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevation view thereof; and,

FIG. 7 is a right side elevation view thereof.

Richards, Benjamin C., Flynn, Greg

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Patent Priority Assignee Title
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Jun 13 2014FLYNN, GREGEMCORE SOLAR POWER, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0333300703 pdf
Jun 13 2014RICHARDS, BENJAMIN C EMCORE SOLAR POWER, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0333300703 pdf
Jun 16 2014Emcore Solar Power, Inc.(assignment on the face of the patent)
Dec 10 2014EMCORE SOLAR POWER, INC CITIZENS BANK OF PENNSYLVANIA, AS ADMINISTRATIVE AGENTSECURITY INTEREST SEE DOCUMENT FOR DETAILS 0346120961 pdf
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Oct 16 2018SOLAERO TECHNOLOGIES CORP CITIZENS BANK OF PENNSYLVANIA, AS ADMINISTRATIVE AGENT FOR THE SECURED PARTIESSECURITY INTEREST SEE DOCUMENT FOR DETAILS 0472460418 pdf
Apr 12 2019SOLAERO TECHNOLOGIES CORP CITIZENS BANK, N A , AS ADMINISTRATIVE AGENTSECURITY INTEREST SEE DOCUMENT FOR DETAILS 0489300952 pdf
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