Patent
   D651992
Priority
Aug 17 2010
Filed
Nov 19 2010
Issued
Jan 10 2012
Expiry
Jan 10 2026
Assg.orig
Entity
unknown
26
23
n/a
The ornamental design for a semiconductor substrate, as shown and described.

FIG. 1 is a front, right, and top perspective view of a semiconductor substrate showing our new design;

FIG. 2 is a front view thereof, a rear view being a mirror image thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right-side view thereof, a left side view being a mirror image thereof;

FIG. 6 is a partially enlarged view at 6 shown in FIG. 2 thereof;

FIG. 7 is a partially enlarged view at 7 shown in FIG. 2 thereof;

FIG. 8 is an enlarged ended view at 8-8 shown in FIG. 3 thereof; and,

FIG. 9 is a partially enlarged sectional view at 9 shown in FIG. 8 thereof.

The broken line showing of the semiconductor substrate is for the purpose of illustrating environmental structure and forms no part of the claimed design.

Sasaki, Makoto, Nishiguchi, Taro, Harada, Shin, Fujiwara, Shinsuke, Namikawa, Yasuo

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D789311, Dec 28 2015 KOKUSAI ELECTRIC CORPORATION Pattern wafer
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D808664, May 16 2016 Ninja Brand Incorporated Sheet with camouflage pattern
D839220, Feb 19 2013 Sony Corporation Semiconductor device
D846513, Apr 27 2016 NGK Insulators, Ltd. Sheet heater for electrostatic chuck
D924823, Jul 19 2018 KOKUSAI ELECTRIC CORPORATION Adiabatic plate for substrate processing apparatus
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Patent Priority Assignee Title
4630093, Nov 24 1983 Sumitomo Electric Industries, Ltd. Wafer of semiconductors
5182233, Aug 02 1989 Kabushiki Kaisha Toshiba Compound semiconductor pellet, and method for dicing compound semiconductor wafer
6927416, Dec 26 2002 Disco Corporation Wafer support plate
7112952, Jan 30 2004 Semiconductor Energy Laboratory Co., Ltd. Inspection system, inspection method, and method for manufacturing semiconductor device
7205639, Mar 09 2005 Infineon Technologies AG Semiconductor devices with rotated substrates and methods of manufacture thereof
7476575, Jun 24 2004 SEMICONDUCTOR ENERGY LABORATORY CO , LTD Method for manufacturing thin film integrated circuit
7705430, Apr 27 2005 Disco Corporation Semiconductor wafer and processing method for same
20050106839,
20050287846,
20060038182,
20060091402,
20070082508,
20090011598,
20100176403,
20110111593,
217594,
D262962, Nov 03 1978 Silicon wafer emitter electrode configuration
D589473, May 30 2007 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
D614593, Jul 21 2008 ASM KOREA LTD Substrate support for a semiconductor deposition apparatus
D638382, Apr 09 2010 SAMSUNG DISPLAY CO , LTD Electroluminescence module
JP200368592,
JP2005260154,
JP832038,
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Oct 18 2010NISHIGUCHI, TAROSUMITOMO ELECTRIC INDUSTRIES, LTDASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0253790712 pdf
Oct 18 2010SASAKI, MAKOTOSUMITOMO ELECTRIC INDUSTRIES, LTDASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0253790712 pdf
Oct 18 2010FUJIWARA, SHINSUKESUMITOMO ELECTRIC INDUSTRIES, LTDASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0253790712 pdf
Oct 19 2010HARADA, SHINSUMITOMO ELECTRIC INDUSTRIES, LTDASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0253790712 pdf
Oct 25 2010NAMIKAWA, YASUOSUMITOMO ELECTRIC INDUSTRIES, LTDASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0253790712 pdf
Nov 19 2010Sumitomo Electric Industries, Ltd.(assignment on the face of the patent)
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