PTO
Wrapper
PDF
Dossier
Espace
Google
Patent
D789311
Priority
Dec 28 2015
Filed
Jun 24 2016
Issued
Jun 13 2017
Expiry
Jun 13 2032
Assg.orig
Entity
unknown
4
24
n/a
The ornamental design for a pattern wafer , as shown and described.
FIG. 1 is a front elevational view of a pattern wafer, showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is an enlarged front portion view taken along line 7 -7 in FIG. 1 ;
FIG. 8 is an enlarged front portion view taken along line 8 -8 in FIG. 1 ;
FIG. 9 is a cross sectional view taken along line 9 -9 in FIG. 7 ; and,
FIG. 10 is a top perspective view of FIG. 8 .
Yamada, Masayuki , Okada, Hiromi , Morita, Shinya , Aizawa, Satoshi , Minami, Masayoshi , Osaka, Kazuhisa
Patent
Priority
Assignee
Title
3461537 ,
4630093 ,
Nov 24 1983
Sumitomo Electric Industries, Ltd.
Wafer of semiconductors
5182233 ,
Aug 02 1989
Kabushiki Kaisha Toshiba
Compound semiconductor pellet, and method for dicing compound semiconductor wafer
5314844 ,
Mar 04 1991
Kabushiki Kaisha Toshiba
Method for dicing a semiconductor wafer
7115984 ,
Jun 18 2002
U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices
7462094 ,
Sep 26 2006
Disco Corporation
Wafer grinding method
7705430 ,
Apr 27 2005
Disco Corporation
Semiconductor wafer and processing method for same
7871928 ,
Oct 11 2005
Intermolecular, Inc.
Methods for discretized processing of regions of a substrate
8555492 ,
Dec 30 2009
Harvatek Corporation
Method for manufacturing a conductive substrate structure with conductive channels formed by using a two-sided cut approach
8865580 ,
Feb 22 2012
Kabushiki Kaisha Toshiba
Pattern forming method, semiconductor device manufacturing method, and coating apparatus
8882917 ,
Dec 31 2009
Intermolecular, Inc
Substrate processing including correction for deposition location
20020121915 ,
20040124413 ,
20040259332 ,
20050170616 ,
20070082508 ,
20110111593 ,
D552565 ,
Sep 08 2005
TOKYO OHKA KOGYO CO , LTD
Supporting plate
D614593 ,
Jul 21 2008
ASM KOREA LTD
Substrate support for a semiconductor deposition apparatus
D651991 ,
Aug 17 2010
Sumitomo Electric Industries, Ltd.
Semiconductor substrate
D651992 ,
Aug 17 2010
Sumitomo Electric Industries, Ltd.
Semiconductor substrate
D655256 ,
Aug 17 2010
Sumitomo Electric Industries, Ltd.
Semiconductor substrate
D716742 ,
Sep 13 2013
ASM IP Holding B.V.
Substrate supporter for semiconductor deposition apparatus
D720313 ,
Jun 16 2014
SOLAERO TECHNOLOGIES CORP
Semiconductor wafer with dicing positions for solar cell fabrication
Executed on Assignor Assignee Conveyance Frame Reel Doc
Jun 07 2016 OSAKA, KAZUHISA TECHNO QUARTZ INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 039033 /0048
pdf
Jun 07 2016 OSAKA, KAZUHISA Hitachi Kokusai Electric Inc ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 039033 /0048
pdf
Jun 15 2016 MINAMI, MASAYOSHI TECHNO QUARTZ INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 039033 /0048
pdf
Jun 15 2016 MORITA, SHINYA TECHNO QUARTZ INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 039033 /0048
pdf
Jun 15 2016 AIZAWA, SATOSHI TECHNO QUARTZ INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 039033 /0048
pdf
Jun 15 2016 YAMADA, MASAYUKI TECHNO QUARTZ INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 039033 /0048
pdf
Jun 15 2016 OKADA, HIROMI TECHNO QUARTZ INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 039033 /0048
pdf
Jun 15 2016 MINAMI, MASAYOSHI Hitachi Kokusai Electric Inc ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 039033 /0048
pdf
Jun 15 2016 MORITA, SHINYA Hitachi Kokusai Electric Inc ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 039033 /0048
pdf
Jun 15 2016 AIZAWA, SATOSHI Hitachi Kokusai Electric Inc ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 039033 /0048
pdf
Jun 15 2016 YAMADA, MASAYUKI Hitachi Kokusai Electric Inc ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 039033 /0048
pdf
Jun 15 2016 OKADA, HIROMI Hitachi Kokusai Electric Inc ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 039033 /0048
pdf
Jun 24 2016 TECHNO QUARTZ INC. (assignment on the face of the patent) /
Jun 24 2016 HITACHI KOKUSAI ELECTRIC INC. (assignment on the face of the patent) /
Mar 29 2019 Hitachi Kokusai Electric Inc KOKUSAI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 049196 /0764
pdf
Date
Maintenance Fee Events
n/a
Date
Maintenance Schedule
n/a