Patent
   D897974
Priority
Mar 29 2018
Filed
Sep 05 2018
Issued
Oct 06 2020
Expiry
Oct 06 2035
Assg.orig
Entity
unknown
0
33
n/a
The ornamental design for a semiconductor wafer, as shown and described.

1.-2. Semiconductor wafer

1.1 : Front view

1.2 : Rear view

1.3 : Top plan view

1.4 : Bottom view

1.5 : Right side view

1.6 : Left side view

1.7 : Enlarged view showing a portion of Reproduction 1.2 defined by lines 1.7-1.7 and 1.7′-1.7

1.8 : Enlarged view showing a portion of Reproduction 1.7 defined by lines 1.8-1.8 and 1.8′-1.8

1.9 : Enlarged view showing a portion of Reproduction 1.7 defined by lines 1.9-1.9 and 1.9′-1.9

1.10 : Enlarged view showing a portion of Reproduction 1.7 defined by lines 1.10-1.10 and 1.10′-1.10

1.11 : Enlarged cross-sectional view along line 1.11 of Reproduction 1.8

1.12 : Enlarged cross-sectional view along line 1.12 of Reproduction 1.9

1.13 : Enlarged cross-sectional view along line 1.13 of Reproduction 1.10

2.1 : Front view

2.2 : Rear view

2.3 : Top plan view

2.4 : Bottom view

2.5 : Right side view

2.6 : Left side view

2.7 : Enlarged view showing a portion of Reproduction 2.2 defined by lines 2.7-2.7 and 2.7′-2.7

2.8 : Enlarged view showing a portion of Reproduction 2.7 defined by lines 2.8-2.8 and 2.8′-2.8

2.9 : Enlarged view showing a portion of Reproduction 2.7 defined by lines 2.9-2.9 and 2.9′-2.9

2.10 : Enlarged view showing a portion of Reproduction 2.7 defined by lines 2.10-2.10 and 2.10′-2.10

2.11: Enlarged cross-sectional view along line 2.11 of Reproduction 2.8

2.12 : Enlarged cross-sectional view along line 2.12 of Reproduction 2.9

2.13 : Enlarged cross-sectional view along line 2.13 of Reproduction 2.10

1.-2. Designs 1 and 2: each article is a wafer used in the production of photodetectors, or the like; the parts shown in solid lines are parts for which design registration is sought; design 1: reproduction 1.7 is an enlarged view of upper left part of reproduction 1.2; reproduction 1.8 is an enlarged view of upper left part of reproduction 1.7; reproduction 1.9 is an enlarged view of bottom left part of reproduction 1.7; reproduction 1.10 is an enlarged view of upper right part of reproduction 1.7; reproduction 1.11 is an enlarged cross-sectional view in the vertical direction of reproduction 1.8; reproduction 1.12 is an enlarged cross-sectional view in the vertical direction of reproduction 1.9; reproduction 1.13 is an enlarged cross-sectional view in the horizontal direction of reproduction 1.10; design 2: reproduction 2.7 is an enlarged view of upper left part of reproduction 2.2; reproduction of 2.8 is an enlarged view of upper left part of reproduction 2.7; reproduction 2.9 is an enlarged view of bottom left part of reproduction 2.7; reproduction 2.10 is an enlarged view of upper right part of reproduction 2.7; reproduction 2.11 is an enlarged cross-sectional view in the vertical direction of reproduction 2.8; reproduction 2.12 is an enlarged cross-sectional view in the vertical direction of reproduction 2.9; reproduction 2.13 is an enlarged cross-sectional view in the horizontal direction of reproduction 2.10. In the drawings, the dash-dot-dash broken lines are for the purpose of illustrating the boundaries of the claimed design and form no part of the claimed design. The evenly spaced broken lines are for the purpose of showing portions of the semiconductor wafer and form no part of the claimed design.

Sakamoto, Takeshi, Taguchi, Tomoya

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Sep 05 2018Hamamatsu Photonics K.K.(assignment on the face of the patent)
Sep 17 2018TAGUCHI, TOMOYAHAMAMATSU PHOTONICS K K ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0486870004 pdf
Sep 17 2018SAKAMOTO, TAKESHIHAMAMATSU PHOTONICS K K ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0486870004 pdf
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