Patent
   D692056
Priority
Dec 19 2012
Filed
Dec 19 2012
Issued
Oct 22 2013
Expiry
Oct 22 2027
Assg.orig
Entity
unknown
13
13
n/a
The ornamental design for a tape, as shown and described.

FIG. 1 is a perspective view showing the new design for a tape;

FIG. 2 is a top view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a front view thereof;

FIG. 5 is a right side view thereof, a left side view being a mirror image thereof; and,

FIG. 6 is a perspective view of the tape in a folded position.

The broken lines in the drawings are shown for illustrative purposes only and form no part of the claimed design. In addition, the surface shading illustrated in the drawings is provided merely to highlight the contour of design; it is not intended to be illustrative of texture or gloss.

Moran, Cristin E., Wolk, Diane R., Miller, Lisa M., Nichol, Bonnie L

Patent Priority Assignee Title
D742965, Dec 05 2013 Duct tape with bacon pattern
D772979, Jul 26 2011 Adhesive tape
D813317, Mar 30 2017 CHROME CHERRY DESIGN STUDIO PTY LTD Tape forming a toy building block base
D813318, Mar 30 2017 CHROME CHERRY DESIGN STUDIO PTY LTD Tape forming a toy building block base
D815216, Mar 30 2017 CHROME CHERRY DESIGN STUDIO PTY LTD Tape forming a toy building block base
D897451, Jul 06 2017 CHROME CHERRY DESIGN STUDIO PTY LTD Tape forming a toy building block base
D917043, Mar 01 2019 LYV LIFE, INC Ultrathin absorbent asymmetrical bladder liner
D917044, Mar 01 2019 LYV LIFE, INC Ultrathin absorbent asymmetrical bladder liner with channels
D926974, Mar 01 2019 LYV LIFE, INC Ultrathin absorbent bladder liner with absorbent pod
D928890, Mar 30 2017 Chrome Cherry Design Studio (Pty) Ltd Tape forming a toy building block base
ER1136,
ER2999,
ER4382,
Patent Priority Assignee Title
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D480811, Nov 06 2001 SAIM, SAID; HORHOTA, STEPHEN; RONDANO, LEIGH ANN; HARDY, MICHAEL Adhesive patch
D513768, Jun 01 2004 Patriotic themed duct tape
D544607, Mar 08 2005 Medicine dispensing patch
D549189, Sep 21 2004 Nitto Denko Corporation Dicing die-bonding film
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D589473, May 30 2007 Nitto Denko Corporation Adhesive film material for use in manufacturing semiconductors
D621803, Jul 16 2008 THE FURUKAWA ELECTRIC CO , LTD Semiconductor wafer processing tape
D628170, Jul 16 2008 THE FURUKAWA ELECTRIC CO , LTD Semiconductor wafer processing tape
D656909, Oct 15 2010 Resonac Corporation Adhesive tape for semiconductor manufacturing
D656910, Oct 15 2010 Resonac Corporation Adhesive tape for semiconductor manufacturing
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D680505, Oct 15 2010 Resonac Corporation Adhesive tape for semiconductor manufacturing
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 19 20123M Innovative Properties Company(assignment on the face of the patent)
May 28 2013MORAN, CRISTIN E 3M Innovative Properties CompanyASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0305440729 pdf
May 28 2013MILLER, LISA M 3M Innovative Properties CompanyASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0305440729 pdf
May 30 2013NICHOL, BONNIE L 3M Innovative Properties CompanyASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0305440729 pdf
Jun 04 2013WOLK, DIANE R 3M Innovative Properties CompanyASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0305440729 pdf
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