Adhesive tape for semiconductor manufacturing

Abstract

Description

FIG. 1 is a top plan view of a first embodiment of our new design;

FIG. 2 is a bottom plan view of the first embodiment;

FIG. 3 is a left side view of the first embodiment;

FIG. 4 is a right side view of the first embodiment;

FIG. 5 is a rear side view of the first embodiment;

FIG. 6 is a front side view of the first embodiment;

FIG. 7 is a cross-sectional view of the first embodiment taken at line 7-7 of FIG. 1;

FIG. 8 is an exploded view of the first embodiment;

FIG. 9 is an enlarged view of the lower and left portion of the claimed design shown in FIG. 1 for completeness of illustration.

FIG. 10 is a top plan view of a second embodiment of our new design;

FIG. 11 is a bottom plan view of the second embodiment;

FIG. 12 is a left side view of the second embodiment;

FIG. 13 is a right side view of the second embodiment;

FIG. 14 is a rear side view of the second embodiment;

FIG. 15 is a front side view of the second embodiment;

FIG. 16 is a cross-sectional view of the second embodiment taken at line 16-16 of FIG. 10;

FIG. 17 is an exploded view of the second embodiment;

FIG. 18 is an enlarged view of the lower and left portion of the claimed design shown in FIG. 10 for completeness of illustration.

FIG. 19 is a top plan view of a third embodiment of our new design;

FIG. 20 is a bottom plan view of the third embodiment;

FIG. 21 is a left side view of the third embodiment;

FIG. 22 is a right side view of the third embodiment;

FIG. 23 is a rear side view of the third embodiment;

FIG. 24 is a front side view of the third embodiment;

FIG. 25 is a cross-sectional view of the third embodiment taken at line 25-25 of FIG. 19;

FIG. 26 is an exploded view of the third embodiment; and,

FIG. 27 is an enlarged view of the lower and left portion of the claimed design shown in FIG. 19 for completeness of illustration.

Claims

The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.