Adhesive tape for semiconductor manufacturing

Abstract

Description

FIG. 1 is a top plan view of our new design;

FIG. 2 is a bottom plan view;

FIG. 3 is a left side view;

FIG. 4 is a right side view;

FIG. 5 is a rear side view;

FIG. 6 is a front side view;

FIG. 7 is a cross sectional view taken at line 7-7 of FIG. 1;

FIG. 8 is an exploded view; and,

FIG. 9 is a close-up view of region 9 in FIG. 1.

Claims

The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.