Patent
   D851611
Priority
Apr 01 2015
Filed
Sep 30 2015
Issued
Jun 18 2019
Expiry
Jun 18 2034
Assg.orig
Entity
unknown
2
15
n/a
The ornamental design for a semiconductor module, as shown and described.

FIG. 1 is a top, front and right side perspective view of the semiconductor module showing my new design;

FIG. 2 is a back side elevational view thereof;

FIG. 3 is a front side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof; and,

FIG. 6 is a top plan view thereof.

The broken line portion of the figure drawings is included to show portions of the article that form no part of the claimed design.

All surfaces not shown form no part of the claimed design.

Kurz, Dorian

Patent Priority Assignee Title
D945384, Sep 26 2019 LAPIS SEMICONDUCTOR CO , LTD Semiconductor module
D962881, May 06 2019 Lam Research Corporation Semiconductor wafer processing apparatus
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 30 2015Infineon Technologies AG(assignment on the face of the patent)
Jan 29 2016KURZ, DORIANInfineon Technologies AGASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0377280476 pdf
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