Panel board for integrated circuit packages

Abstract

Description

FIG. 1 is a top plan view of one side of a panel board for integrated circuit packages showing my new design, the other side being substantially identical thereto;

FIG. 2 is a side elevational view thereof;

FIG. 3 is a fragmentary, front elevational view thereof, the board being broken away for convenience of illustration;

FIG. 4 is a fragmentary, rear elevational view thereof, the board being broken away for convenience of illustration.

Claims

The ornamental design for a panel board for integrated circuit packages, substantially as shown and described.