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The ornamental design for an electrode plate for a plasma processing apparatus, as shown and described.
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This application contains subject matter related to the following co-pending U.S. design patent applications:
Application Ser. No. 29/635,289, filed herewith and entitled “Gas Ring for a Plasma Processing Apparatus”;
Application Ser. No. 29/635,292, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”; and
Application Ser. No. 29/635,296, filed herewith and entitled “Electrode Plate Peripheral Ring for a Plasma Processing Apparatus”.
The broken lines show the boundaries of the enlarged portions illustrated in
Mori, Masahito, Yokogawa, Kenetsu, Arase, Takao, Isozaki, Masakazu, Hashimoto, Takahisa
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| Jun 13 2018 | ISOZAKI, MASAKAZU | Hitachi High-Technologies Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 046536 | /0291 | |
| Jun 13 2018 | MORI, MASAHITO | Hitachi High-Technologies Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 046536 | /0291 | |
| Jun 13 2018 | ARASE, TAKAO | Hitachi High-Technologies Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 046536 | /0291 | |
| Jun 13 2018 | HASHIMOTO, TAKAHISA | Hitachi High-Technologies Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 046536 | /0291 | |
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