FIG. 1 is a front plan view of an electroplating flow shaping plate having offset spiral hole pattern showing an embodiment of our new design;
FIG. 2 is a bottom view thereof;
FIG. 3 is a right side elevational view thereof, the left, top and bottom side elevational views being identical images thereof;
FIG. 4 is a front perspective view thereof; and
FIG. 5 is a rear perspective view thereof.
FIG. 6 is a front plan view of an electroplating flow shaping plate having offset spiral hole pattern showing a second embodiment of our new design;
FIG. 7 is a bottom view thereof;
FIG. 8 is a right side elevational view thereof, the left, top and bottom side elevational views being identical images thereof;
FIG. 9 is a front perspective view thereof; and
FIG. 10 is a rear perspective view thereof.
FIG. 11 is a front plan view of an electroplating flow shaping plate having offset spiral hole pattern showing a third embodiment of our new design;
FIG. 12 is a bottom view thereof; and
FIG. 13 is a right side elevational view thereof, the left, top and bottom side elevational views being identical images thereof;
FIG. 14 is a front perspective view thereof; and
FIG. 15 is a rear perspective view thereof.
FIG. 16 is a front plan view of an electroplating flow shaping plate having offset spiral hole pattern showing a fourth embodiment of our new design;
FIG. 17 is a bottom view thereof; and
FIG. 18 is a right side elevational view thereof, the left, top and bottom side elevational views being identical images thereof;
FIG. 19 is a front perspective view thereof; and,
FIG. 20 is a rear perspective view thereof.
Patent |
Priority |
Assignee |
Title |
10014170, |
May 14 2015 |
Lam Research Corporation |
Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
10094034, |
Aug 28 2015 |
Lam Research Corporation |
Edge flow element for electroplating apparatus |
10190230, |
Jul 02 2010 |
Novellus Systems, Inc. |
Cross flow manifold for electroplating apparatus |
10233556, |
Jul 02 2010 |
Lam Research Corporation |
Dynamic modulation of cross flow manifold during electroplating |
10301739, |
May 01 2013 |
Lam Research Corporation |
Anisotropic high resistance ionic current source (AHRICS) |
10364505, |
May 24 2016 |
Lam Research Corporation |
Dynamic modulation of cross flow manifold during elecroplating |
10662545, |
Dec 12 2012 |
Novellus Systems, Inc. |
Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
10781527, |
Sep 18 2017 |
Lam Research Corporation |
Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
10923340, |
May 14 2015 |
Lam Research Corporation |
Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
11001934, |
Aug 21 2017 |
Lam Research Corporation |
Methods and apparatus for flow isolation and focusing during electroplating |
11047059, |
May 24 2016 |
Lam Research Corporation |
Dynamic modulation of cross flow manifold during elecroplating |
8308931, |
Aug 16 2006 |
Novellus Systems, Inc |
Method and apparatus for electroplating |
8475636, |
Nov 07 2008 |
Novellus Systems, Inc |
Method and apparatus for electroplating |
8475644, |
Mar 27 2000 |
Novellus Systems, Inc. |
Method and apparatus for electroplating |
8540857, |
Dec 19 2008 |
Novellus Systems, Inc. |
Plating method and apparatus with multiple internally irrigated chambers |
8623193, |
Jun 16 2004 |
Novellus Systems, Inc. |
Method of electroplating using a high resistance ionic current source |
8795480, |
Jul 02 2010 |
Novellus Systems, Inc |
Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
8968533, |
May 10 2012 |
Applied Materials, Inc |
Electroplating processor with geometric electrolyte flow path |
9309604, |
Nov 07 2008 |
Novellus Systems, Inc. |
Method and apparatus for electroplating |
9394620, |
Jul 02 2010 |
Novellus Systems, Inc. |
Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
9449808, |
May 29 2013 |
Novellus Systems, Inc. |
Apparatus for advanced packaging applications |
9464361, |
Jul 02 2010 |
Novellus Systems, Inc. |
Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
9523155, |
Dec 12 2012 |
Novellus Systems, Inc |
Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
9624592, |
Jul 02 2010 |
Novellus Systems, Inc |
Cross flow manifold for electroplating apparatus |
9670588, |
May 01 2013 |
Lam Research Corporation |
Anisotropic high resistance ionic current source (AHRICS) |
9816194, |
Mar 19 2015 |
Lam Research Corporation |
Control of electrolyte flow dynamics for uniform electroplating |
9834852, |
Dec 12 2012 |
Novellus Systems, Inc. |
Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
9899230, |
May 29 2013 |
Novellus Systems, Inc. |
Apparatus for advanced packaging applications |
D664249, |
Jul 01 2011 |
Applied Materials, Inc |
Flow blocker plate |
D693782, |
Nov 19 2012 |
Applied Materials, Inc |
Lid for epitaxial growing device |
D699199, |
Sep 30 2011 |
Tokyo Electron Limited |
Electrode plate for a plasma processing apparatus |
D699200, |
Sep 30 2011 |
Tokyo Electron Limited |
Electrode member for a plasma processing apparatus |
D709536, |
Sep 30 2011 |
Tokyo Electron Limited |
Focusing ring |
D709537, |
Sep 30 2011 |
Tokyo Electron Limited |
Focusing ring |
D709538, |
Sep 30 2011 |
Tokyo Electron Limited |
Focusing ring |
D709539, |
Sep 30 2011 |
Tokyo Electron Limited |
Focusing ring |
D793971, |
Mar 27 2015 |
Veeco Instruments INC |
Wafer carrier with a 14-pocket configuration |
D793972, |
Mar 27 2015 |
Veeco Instruments INC |
Wafer carrier with a 31-pocket configuration |
D793976, |
May 15 2013 |
Ebara Corporation |
Substrate retaining ring |
D806046, |
Apr 16 2015 |
Veeco Instruments Inc. |
Wafer carrier with a multi-pocket configuration |
D852762, |
Mar 27 2015 |
Veeco Instruments Inc. |
Wafer carrier with a 14-pocket configuration |
D868995, |
Nov 06 2017 |
HITACHI HIGH-TECH CORPORATION |
Gas diffusion plate for a plasma processing apparatus |
D873782, |
May 17 2016 |
Electro Scientific Industries, Inc |
Component carrier plate |
Patent |
Priority |
Assignee |
Title |
4304641, |
Nov 24 1980 |
International Business Machines Corporation |
Rotary electroplating cell with controlled current distribution |
5078852, |
Oct 12 1990 |
Microelectronics and Computer Technology Corporation |
Plating rack |
5660699, |
Feb 20 1995 |
Kao Corporation |
Electroplating apparatus |
5744019, |
Nov 29 1995 |
AIWA CO , LTD |
Method for electroplating metal films including use a cathode ring insulator ring and thief ring |
6004440, |
Sep 18 1997 |
Applied Materials Inc |
Cathode current control system for a wafer electroplating apparatus |
6080291, |
Jul 10 1998 |
Applied Materials Inc |
Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member |
6398926, |
May 31 2000 |
TECHPOINT PACIFIC SINGAPORE PTE LTD |
Electroplating apparatus and method of using the same |
6497801, |
Jul 10 1998 |
Applied Materials Inc |
Electroplating apparatus with segmented anode array |
6521102, |
Mar 24 2000 |
Applied Materials, Inc.; Applied Materials, Inc |
Perforated anode for uniform deposition of a metal layer |
6632335, |
Dec 24 1999 |
Ebara Corporation |
Plating apparatus |
6921468, |
Sep 30 1997 |
Semitool, Inc. |
Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
7641776, |
Mar 10 2005 |
Bell Semiconductor, LLC |
System and method for increasing yield from semiconductor wafer electroplating |
7670465, |
Jul 24 2002 |
Applied Materials, Inc. |
Anolyte for copper plating |
7935240, |
May 25 2005 |
Applied Materials, Inc |
Electroplating apparatus and method based on an array of anodes |
20070068819, |
|
|
|
20110031112, |
|
|
|
D544452, |
Sep 08 2005 |
BISSEL INC ; BISSELL INC |
Supporting plate |
D548705, |
Sep 29 2005 |
Tokyo Electron Limited |
Attracting disc for an electrostatic chuck for semiconductor production |
D552565, |
Sep 08 2005 |
TOKYO OHKA KOGYO CO , LTD |
Supporting plate |
D553104, |
Apr 21 2004 |
Tokyo Electron Limited |
Absorption board for an electric chuck used in semiconductor manufacture |
D587222, |
Aug 01 2006 |
Tokyo Electron Limited; SUMITOMO OSAKA CEMENT CO , LTD |
Attracting plate of an electrostatic chuck for semiconductor manufacturing |
D609652, |
Jul 22 2008 |
Tokyo Electron Limited |
Wafer attracting plate |
D609655, |
Oct 03 2008 |
NGK Insulators, Ltd. |
Electrostatic chuck |
D614593, |
Jul 21 2008 |
ASM KOREA LTD |
Substrate support for a semiconductor deposition apparatus |