Electrostatic chuck for semiconductor manufacture

Abstract

Description

1. Electrostatic chuck for semiconductor manufacture

FIG. 1.1 is a front perspective view of an electrostatic chuck for semiconductor manufacture showing my new design;

FIG. 1.2 is another front perspective view thereof;

FIG. 1.3 is a front elevation view thereof;

FIG. 1.4 is a top plan view thereof;

FIG. 1.5 is a bottom plan view thereof;

FIG. 1.6 is a left side elevation view thereof;

FIG. 1.7 is a right side elevation view thereof;

FIG. 1.8 is an enlarged portion view labeled, “Fig. 1.8” in Fig. 1.1; and

FIG. 1.9 is an enlarged portion view labeled, “Fig. 1.9” in Fig. 1.2.

The dashed-dot lines in Figs. 1.1, 1.2,1.8 and 1.9 denote the boundaries of the enlarged portion views shown in Figs. 1.8 and 1.9 and form no part of the claimed design.

Claims

The ornamental design for an electrostatic chuck semi conductor manufacture, as shown and described.