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Patent
   D546784
Priority
Sep 29 2005
Filed
Dec 19 2005
Issued
Jul 17 2007
Expiry
Jul 17 2021
Inventors
Hayashi, D…
Assg.orig
Tokyo Elec…
Assg.curr
Tokyo Elec…
Entity
unknown
Referenced by
27
References
18
Maint.:
n/a
The ornamental design for an attracting disc for an electrostatic chuck for semiconductor production, as shown and described.

FIG. 1 is a front elevational view of an attracting disc for an electrostatic chuck for semiconductor production, showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.
INVENTORS:

Hayashi, Daisuke

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
D570310, Aug 01 2006 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
D587222, Aug 01 2006 Tokyo Electron Limited; SUMITOMO OSAKA CEMENT CO , LTD Attracting plate of an electrostatic chuck for semiconductor manufacturing
D668211, Sep 10 2010 Novellus Systems, Inc. Segmented electroplating anode and anode segment
D674759, Aug 19 2010 EPISTAR CORPORATION Wafer carrier
D689032, Apr 21 2011 Panasonic Corporation Electrostatic atomized water particle generating module
D699199, Sep 30 2011 Tokyo Electron Limited Electrode plate for a plasma processing apparatus
D699200, Sep 30 2011 Tokyo Electron Limited Electrode member for a plasma processing apparatus
D704155, Feb 18 2011 EPISTAR CORPORATION Wafer carrier
D709536, Sep 30 2011 Tokyo Electron Limited Focusing ring
D709537, Sep 30 2011 Tokyo Electron Limited Focusing ring
D709538, Sep 30 2011 Tokyo Electron Limited Focusing ring
D709539, Sep 30 2011 Tokyo Electron Limited Focusing ring
D711330, Dec 28 2010 Ebara Corporation Elastic membrane for semiconductor wafer polishing
D716742, Sep 13 2013 ASM IP Holding B.V. Substrate supporter for semiconductor deposition apparatus
D723077, Dec 03 2013 Applied Materials, Inc Chuck carrier film
D724553, Sep 13 2013 ASM IP Holding B.V. Substrate supporter for semiconductor deposition apparatus
D729753, Dec 28 2010 Ebara Corporation Elastic membrane for semiconductor wafer polishing
D734377, Mar 28 2013 HIRATA CORPORATION Top cover of a load lock chamber
D795208, Aug 18 2015 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
D802472, Aug 06 2015 Pall Corporation Electrostatic chuck for semiconductor manufacturing equipment
D803802, Aug 18 2015 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
D839224, Dec 12 2016 Ebara Corporation Elastic membrane for semiconductor wafer polishing
D913256, Jul 31 2019 Antenna pattern for a semiconductive substrate carrier
D913977, Dec 12 2016 Ebara Corporation Elastic membrane for semiconductor wafer polishing
D926716, Jul 31 2019 Antenna pattern for a semiconductive substrate carrier
D947802, May 20 2020 Applied Materials, Inc Replaceable substrate carrier interfacing film
D984972, Mar 29 2021 BEIJING NAURA MICROELECTRONICS EQUIPMENT CO , LTD Electrostatic chuck for semiconductor manufacture
THIS PATENT REFERENCES THESE PATENTS:
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4502094, Sep 14 1981 U S PHILIPS CORPORATION Electrostatic chuck
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ASSIGNMENT RECORDS    Assignment records on the USPTO
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 19 2005Tokyo Electron Limited(assignment on the face of the patent)
Mar 22 2006HAYASHI, DAISUKETokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0177560762 pdf
MAINTENANCE FEES AND DATES:    Maintenance records on the USPTO
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