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Patent
   D981459
Priority
Jun 16 2021
Filed
Jun 16 2021
Issued
Mar 21 2023
Expiry
Mar 21 2038
Inventors
Nabeya, Os…
Assg.orig
Ebara Corp…
Assg.curr
Ebara Corp…
Entity
unknown
Referenced by
2
References
18
Maint.:
n/a
The ornamental design for a retainer ring for substrate, as shown and described.

1. Retaining ring for substrate

1.1 : Perspective

1.2 : Perspective

1.3 : Bottom

1.4 : Top

1.5 : Front

1.6 : Cross sectional

1.7 : Cross sectional

1.8 : Cross sectional

This article is used to hold a substrate in a ring and polish one side of the substrate during the polishing process of wafers and other substrates in the manufacture of semiconductors and other products; the rear view, right side view, and left side view are all represented identically to the front view.
INVENTORS:

Nabeya, Osamu, Akazawa, Kenichi

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
ER5949,
ER918,
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
11390945, Jul 03 2019 ASM IP Holding B.V. Temperature control assembly for substrate processing apparatus and method of using same
11396082, Nov 13 2017 Ebara Corporation Substrate holding device and substrate processing apparatus including the same
D638951, Nov 13 2009 DIASORIN ITALIA S P A Sample processing disk cover
D667561, Nov 13 2009 DIASORIN ITALIA S P A Sample processing disk cover
D699200, Sep 30 2011 Tokyo Electron Limited Electrode member for a plasma processing apparatus
D703160, Jan 27 2011 HITACHI HIGH-TECH CORPORATION Grounded electrode for a plasma processing apparatus
D709536, Sep 30 2011 Tokyo Electron Limited Focusing ring
D766849, May 15 2013 Ebara Corporation Substrate retaining ring
D770992, Jun 12 2015 HITACHI HIGH-TECH CORPORATION Electrode cover for a plasma processing apparatus
D793976, May 15 2013 Ebara Corporation Substrate retaining ring
D794585, Oct 06 2015 Ebara Corporation Retainer ring for substrate
D799437, Aug 25 2015 Ebara Corporation Substrate retaining ring
D845568, May 14 2015 Ebara Corporation Pad holder for polishing apparatus
D876504, Apr 03 2017 ASM IP Holding B.V.; ASM IP HOLDING B V Exhaust flow control ring for semiconductor deposition apparatus
D922229, Jun 05 2019 ASM IP Holding B.V. Device for controlling a temperature of a gas supply unit
D940670, Sep 26 2019 WILLBE S&T CO., LTD.; WILLBE S&T CO , LTD Retainer ring for chemical mechanical polishing device
D943539, Mar 19 2020 Applied Materials, Inc Confinement plate for a substrate processing chamber
JP1494712,
ASSIGNMENT RECORDS    Assignment records on the USPTO
///
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 16 2021Ebara Corporation(assignment on the face of the patent)
Dec 05 2022AKAZAWA, KENICHIEbara CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0620500532 pdf
Dec 05 2022NABEYA, OSAMUEbara CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0620500532 pdf
MAINTENANCE FEES AND DATES:    Maintenance records on the USPTO
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