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Patent
D559066
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Priority
Oct 26 2004
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Filed
Apr 26 2005
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Issued
Jan 08 2008
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Expiry
Jan 08 2022
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Assg.orig
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Entity
unknown
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21
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53
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n/a
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The ornamental design for a polishing pad, as shown and described.
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FIG. 1 is a top plan view of a polishing pad showing our new design;
FIG. 2 is a front elevational view thereof, the rear elevation view, left and right side elevational views being a mirror image of the side shown;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a partial, enlarged view of portion 4—4 in FIG. 1;
FIG. 5 is a partial, enlarged sectional view taken along line 5—5 in FIG. 4
FIG. 6 is a partial, enlarged sectional view taken along line 6—6 in FIG. 4;
FIG. 7 is a partial, greatly enlarged sectional view of portion 7 in FIG. 5; and,
FIG. 8 is a partial, enlarged view of portion 8—8 in FIG. 1.
Shiho, Hiroshi, Tano, Hiroyuki
| Patent |
Priority |
Assignee |
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Grooved CMP pad |
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Jan 26 2011 |
CMC MATERIALS LLC |
Polishing pad with concentric or approximately concentric polygon groove pattern |
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Mar 17 2004 |
JSR Corporation |
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CMP platen with patterned surface |
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Polishing pad having a grooved pattern for use in chemical mechanical polishing |
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Dec 27 2002 |
Rohm and Haas Electronic Materials CMP Holdings, Inc |
Perforated-transparent polishing pad |
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Nov 19 1998 |
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Lapping and polishing device |
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Aug 10 2004 |
Universal Photonics, Inc. |
Polishing pad and method of producing the same |
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Sep 17 2002 |
Korea Polyol Co., Ltd. |
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Applied Materials, Inc. |
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Polishing pad and method of fabricating semiconductor substrate using the pad |
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Jul 17 2003 |
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| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a