FIG. 1 is a top plan view of a polishing pad showing our new design;
FIG. 2 is a front elevational view thereof, the rear elevation view, left and right side elevational views being a mirror image of the side shown;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a partial, enlarged view of portion 4—4 in FIG. 1;
FIG. 5 is a partial, enlarged sectional view taken along line 5—5 in FIG. 4
FIG. 6 is a partial, enlarged sectional view taken along line 6—6 in FIG. 4;
FIG. 7 is a partial, greatly enlarged sectional view of portion 7 in FIG. 5; and,
FIG. 8 is a partial, enlarged view of portion 8—8 in FIG. 1.
Patent |
Priority |
Assignee |
Title |
10011999, |
Sep 18 2014 |
HUSQVARNA AB |
Method for finishing a surface using a grouting pan |
10246885, |
Sep 18 2014 |
HUSQVARNA AB |
Grouting pan assembly with reinforcement ring |
10414012, |
Jan 13 2017 |
HUSQVARNA AB |
Grinding pad apparatus |
10667665, |
Sep 24 2015 |
HUSQVARNA AB |
Method of using polishing or grinding pad assembly |
10710214, |
Jan 11 2018 |
DIAMOND TOOL SUPPLY, INC |
Polishing or grinding pad with multilayer reinforcement |
11084140, |
Sep 24 2015 |
HUSQVARNA AB |
Method of using polishing or grinding pad assembly |
9180570, |
Mar 14 2008 |
CMC MATERIALS LLC |
Grooved CMP pad |
D678745, |
Jul 07 2011 |
|
Spinning insert polishing pad |
D795666, |
Jun 06 2014 |
HUSQVARNA AB |
Polishing pad |
D837015, |
Jun 06 2014 |
HUSQVARNA AB |
Polishing pad |
D854902, |
Sep 23 2016 |
HUSQVARNA AB |
Polishing or grinding pad |
D873108, |
Jun 06 2014 |
HUSQVARNA AB |
Polishing pad |
D873782, |
May 17 2016 |
Electro Scientific Industries, Inc |
Component carrier plate |
D894137, |
Oct 05 2017 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D902165, |
Mar 09 2018 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D908645, |
Aug 26 2019 |
Applied Materials, Inc |
Sputtering target for a physical vapor deposition chamber |
D919396, |
Aug 30 2017 |
HUSQVARNA AB |
Polishing or grinding pad assembly with abrasive disks, reinforcement and pad |
D927952, |
Aug 30 2017 |
HUSQVARNA AB |
Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad |
D933440, |
Sep 23 2016 |
HUSQVARNA AB |
Polishing or grinding pad |
D933725, |
Feb 08 2019 |
Applied Materials, Inc |
Deposition ring for a substrate processing chamber |
D937329, |
Mar 23 2020 |
Applied Materials, Inc |
Sputter target for a physical vapor deposition chamber |
D940765, |
Dec 02 2020 |
Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D941371, |
Mar 20 2020 |
Applied Materials, Inc |
Process shield for a substrate processing chamber |
D941372, |
Mar 20 2020 |
Applied Materials, Inc |
Process shield for a substrate processing chamber |
D942516, |
Feb 08 2019 |
Applied Materials, Inc |
Process shield for a substrate processing chamber |
D946638, |
Dec 11 2017 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D958626, |
Aug 30 2017 |
HUSQVARNA AB |
Polishing or grinding pad assembly with abrasive disks, reinforcement and pad |
D966357, |
Dec 02 2020 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D970566, |
Mar 23 2020 |
Applied Materials, Inc. |
Sputter target for a physical vapor deposition chamber |
ER6877, |
|
|
|
Patent |
Priority |
Assignee |
Title |
4693036, |
Dec 28 1983 |
Disco Abrasive Systems, Ltd. |
Semiconductor wafer surface grinding apparatus |
494471, |
|
|
|
5007207, |
Dec 22 1987 |
|
Abrasive product |
5400547, |
Feb 28 1992 |
Shin-Etsu Handotai Co., Ltd. |
Polishing machine and method of dissipating heat therefrom |
5718620, |
Feb 28 1992 |
Shin-Etsu Handotai |
Polishing machine and method of dissipating heat therefrom |
5851140, |
Feb 13 1997 |
Novellus Systems, Inc |
Semiconductor wafer polishing apparatus with a flexible carrier plate |
5899799, |
Jan 19 1996 |
Micron Technology, Inc |
Method and system to increase delivery of slurry to the surface of large substrates during polishing operations |
5921855, |
May 15 1997 |
Applied Materials, Inc |
Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
5984769, |
May 15 1997 |
Applied Materials, Inc |
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
6033293, |
Oct 08 1997 |
THE CHASE MANHATTAN BANK, AS COLLATERAL AGENT |
Apparatus for performing chemical-mechanical polishing |
6056632, |
Feb 13 1997 |
Novellus Systems, Inc |
Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
6089966, |
Nov 25 1997 |
SPEEDFAM CO , LTD |
Surface polishing pad |
6220942, |
Apr 02 1999 |
Applied Materials, Inc.; Applied Materials, Inc |
CMP platen with patterned surface |
6332830, |
Aug 04 1998 |
Shin-Etsu Handotai Co., Ltd. |
Polishing method and polishing device |
6402594, |
Jan 18 1999 |
Shin-Etsu Handotai Co., Ltd. |
Polishing method for wafer and holding plate |
6422922, |
Feb 12 1999 |
Shin-Etsu Handotai Co., Ltd. |
Workpiece holder for polishing, apparatus for polishing workpiece and method for polishing workpiece |
6517417, |
Feb 25 2000 |
Rohm and Haas Electronic Materials CMP Holdings, Inc |
Polishing pad with a transparent portion |
6520847, |
May 15 1997 |
Applied Materials, Inc. |
Polishing pad having a grooved pattern for use in chemical mechanical polishing |
6592438, |
Apr 02 1999 |
Applied Materials Inc. |
CMP platen with patterned surface |
6645061, |
May 15 1997 |
Applied Materials, Inc. |
Polishing pad having a grooved pattern for use in chemical mechanical polishing |
6824447, |
Dec 27 2002 |
Rohm and Haas Electronic Materials CMP Holdings, Inc |
Perforated-transparent polishing pad |
6837780, |
Nov 19 1998 |
LAM-PLAN S A |
Lapping and polishing device |
6986706, |
Aug 10 2004 |
Universal Photonics, Inc. |
Polishing pad and method of producing the same |
7029747, |
Sep 17 2002 |
Korea Polyol Co., Ltd. |
Integral polishing pad and manufacturing method thereof |
7112119, |
Aug 26 2005 |
Applied Materials, Inc. |
Sealed polishing pad methods |
7121938, |
Apr 03 2002 |
Toho Engineering Kabushiki Kaisha |
Polishing pad and method of fabricating semiconductor substrate using the pad |
7140955, |
Jun 06 2001 |
Ebara Corporation |
Polishing apparatus |
7183213, |
Jul 17 2003 |
JSR Corporation |
Chemical mechanical polishing pad and chemical mechanical polishing method |
7201640, |
Mar 31 2004 |
Fujikoshi Machinery Corp. |
Method of sucking water and water sucking device |
7329174, |
May 20 2004 |
JSR Corporation |
Method of manufacturing chemical mechanical polishing pad |
7357703, |
Dec 28 2005 |
JSR Corporation |
Chemical mechanical polishing pad and chemical mechanical polishing method |
88649, |
|
|
|
20010005667, |
|
|
|
20010034198, |
|
|
|
20020137450, |
|
|
|
20030092371, |
|
|
|
20040053566, |
|
|
|
20040072516, |
|
|
|
20040082271, |
|
|
|
20040127145, |
|
|
|
20040259483, |
|
|
|
20050113011, |
|
|
|
20050142996, |
|
|
|
20050148183, |
|
|
|
20050191945, |
|
|
|
20050211376, |
|
|
|
20050245171, |
|
|
|
20060037699, |
|
|
|
20060063471, |
|
|
|
20060229002, |
|
|
|
20060276109, |
|
|
|
20070049167, |
|
|
|
20070149096, |
|
|
|
20070197143, |
|
|
|
20080003935, |
|
|
|
20080064311, |
|
|
|
20080070488, |
|
|
|
D376744, |
Aug 03 1994 |
Gerd Eisenblatter GmbH |
Support plate |
D490827, |
Dec 20 2002 |
NGK SPARK PLUG CO , LTD |
Electrostatic chuck |
D510850, |
Dec 20 2002 |
Production Chemical Mfg. Inc. |
Polishing pad |
D559063, |
Mar 17 2004 |
JSR Corporation |
Polishing pad |
D559064, |
Mar 17 2004 |
JSR Corporation |
Polishing pad |
D559065, |
Oct 05 2004 |
JSR Corporation |
Polishing pad |
D559648, |
Oct 05 2004 |
JRS Corporation |
Polishing pad |
JP115633, |
|
|
|
JP1156872, |
|
|
|