Patent
   D852601
Priority
Apr 24 2017
Filed
Oct 23 2017
Issued
Jul 02 2019
Expiry
Jul 02 2034
Assg.orig
Entity
unknown
2
20
n/a
The ornamental design for a polishing pad, as shown and described.

FIG. 1 is a front perspective view of a polishing pad, showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a perspective view of a plurality thereof in their intended environment.

The broken line showings in FIG. 8 are for the purpose of illustrating environmental structure and form no part of the claimed design.

Ahn, Jang Hyuk, Son, Jun Seok

Patent Priority Assignee Title
D876194, Sep 06 2017 UCANC INTERTECH CO LTD Polishing pad
D876195, Jun 13 2018 Polishing pad
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 23 2017EHWA Diamond Ind. Co., Ltd.(assignment on the face of the patent)
Oct 24 2017SON, JUN SEOKEHWA DIAMOND IND CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0444320957 pdf
Oct 24 2017AHN, JANG HYUKEHWA DIAMOND IND CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0444320957 pdf
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