Patent
   D685335
Priority
Nov 24 2010
Filed
Nov 24 2010
Issued
Jul 02 2013
Expiry
Jul 02 2027
Assg.orig
Entity
unknown
3
15
n/a
The ornamental design for a substrate support, as shown and described.

FIG. 1 is a top plan view of the substrate support.

FIG. 2 is a side elevation view of the substrate support, the opposite side being a mirror image.

FIG. 3 is a bottom plan view of the substrate support.

FIG. 4 is a side elevation view of the substrate support, the opposite side being a mirror image.

FIG. 5 is a detailed view of FIG. 1.

FIG. 6 is a detailed view of FIG. 1.

FIG. 7 is a detailed view of FIG. 2.

FIG. 8 is a detailed view of FIG. 1.

FIG. 9 is a detailed view of FIG. 3.

FIG. 10 is a detailed view of elements shown on FIG. 1 and FIG. 3; and,

FIG. 11 is a detailed view of FIG. 3.

Excepting the details along the perimeter edges of the design in FIGS. 1, 2, and 4, the remainder of the details in FIGS. 1 through 4 are in broken lines as represented in FIGS. 5 through 11, and form no part of the claimed design.

Tiner, Robin L.

Patent Priority Assignee Title
D758300, Nov 24 2014 THERMO KING LLC Solar panel battery charger for a transport refrigeration unit
D806249, Dec 16 2014 HAMAMATSU PHOTONICS K K Radiation image conversion plate
D852958, Dec 16 2014 Hamamatsu Photonics K.K. Radiation image conversion plate
Patent Priority Assignee Title
5671116, Mar 10 1995 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
5844205, Apr 19 1996 APPLIED KOMATSU TECHNOLOGY, INC Heated substrate support structure
5846375, Sep 26 1996 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Area specific temperature control for electrode plates and chucks used in semiconductor processing equipment
6035101, Feb 12 1997 Applied Materials, Inc. High temperature multi-layered alloy heater assembly and related methods
6163015, Jul 21 1999 Moore Epitaxial, Inc. Substrate support element
6231674, Feb 23 1994 Applied Materials, Inc. Wafer edge deposition elimination
6843421, Aug 13 2001 SanDisk Technologies LLC Molded memory module and method of making the module absent a substrate support
7429718, Aug 02 2005 Applied Materials, Inc Heating and cooling of substrate support
20020066726,
20050067102,
20060118243,
20080035306,
20110120325,
D570310, Aug 01 2006 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
D587222, Aug 01 2006 Tokyo Electron Limited; SUMITOMO OSAKA CEMENT CO , LTD Attracting plate of an electrostatic chuck for semiconductor manufacturing
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 17 2009TINER, ROBIN L Applied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0257800372 pdf
Nov 24 2010Applied Materials, Inc.(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule