Patent
   D407696
Priority
Aug 20 1997
Filed
Feb 02 1998
Issued
Apr 06 1999
Expiry
Apr 06 2013
Assg.orig
Entity
unknown
32
4
n/a
I claim the ornamental design for inner tube for use in a semiconductor wafer heat processing apparatus, as shown and described.

FIG. 1 a perspective view of an inner tube for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a front elevational view thereof;

FIG. 3 a top plan view thereof; and,

FIG. 4 a cross-sectional view taken along line IV--IV in FIG. 3.

Shimazu, Tomohisa

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Patent Priority Assignee Title
4857689, Mar 23 1988 Axcelis Technologies, Inc Rapid thermal furnace for semiconductor processing
5314574, Jun 26 1992 Tokyo Electron Kabushiki Kaisha Surface treatment method and apparatus
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//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 02 1998Tokyo Electron Limited(assignment on the face of the patent)
Apr 15 1998SHIMAZU, TOMOHISATokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0091520914 pdf
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