Integrated circuit electronic package

Abstract

Description

FIG. 1 is a left, front perspective view showing my new integrated circuit electronic package design as it is attached to an integrated circuit;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a right side elevational view thereof which is a mirror image of the left side elevational view.

Claims

The ornamental design for an integrated circuit electronic package, as shown and described.