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The ornamental design for a combined integrated circuit package carrier and socket assembly, as shown and described. |
FIG. 1 is a top plan view of a combined integrated circuit package carrier and socket assembly, showing our new design.
FIG. 2 is a left side elevational view thereof on a reduced scale.
FIG. 3 is a bottom plan view thereof on a reduced scale.
FIG. 4 is a right side elevational view thereof on a reduced scale.
FIG. 5 is a front elevational view thereof on a reduced scale.
FIG. 6 is a rear elevational view thereof on a reduced scale.
FIG. 7 is an isometric view thereof on a reduced scale looking generally downward.
FIG. 8 is an isometric view thereof on a reduced scale looking generally upward.
Jones, James C., Emerson, James A.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 02 1980 | JONES JAMES C | Robinson Nugent, Inc | ASSIGNMENT OF ASSIGNORS INTEREST | 003854 | /0797 | |
Mar 02 1980 | EMERSON JAMES A | Robinson Nugent, Inc | ASSIGNMENT OF ASSIGNORS INTEREST | 003854 | /0797 | |
Feb 23 1981 | Robinson-Nugent, Inc. | (assignment on the face of the patent) | / |
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