Patent
   D725054
Priority
Jul 31 2013
Filed
Jul 31 2013
Issued
Mar 24 2015
Expiry
Mar 24 2029
Assg.orig
Entity
unknown
7
20
n/a
The ornamental design for a ground fault circuit interrupter (GFCI) printed circuit board package, as shown and described.

FIG. 1 is a top perspective view of a ground fault circuit interrupter (GFCI) printed circuit board package showing our new design;

FIG. 2 is a rear elevation view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side view thereof; and,

FIG. 7 is a right side view thereof.

The broken lines shown in the drawings of FIGS. 1-7 represent portions of the ground fault circuit interrupter (GFCI) printed circuit board package that form no part of the claimed design.

Mertler, Michael S

Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 31 2013Tower Manufacturing Corporation(assignment on the face of the patent)
Feb 15 2014MERTLER, MICHAEL STower Manufacturing CompanyASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0349700442 pdf
Dec 17 2014RAO, CHEPUR P Tower Manufacturing CompanyASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0349700536 pdf
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