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Patent
D737230
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Priority
Dec 28 2010
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Filed
Feb 06 2014
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Issued
Aug 25 2015
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Expiry
Aug 25 2029
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Assg.orig
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Entity
unknown
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3
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30
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n/a
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The ornamental design for a semiconductor device, as shown and described.
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FIG. 1 is a front view of a semiconductor device showing my new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is an enlarged perspective view showing the area defined by indicia 7A and 7B of FIG. 1 thereof; and,
FIG. 8 is an enlarged perspective view showing the area defined by indicia 7A and 8C of FIG. 1 thereof.
The broken line showing is for illustrative purpose only and forms no part of the claimed design.
Masuda, Takeyoshi
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Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a