Patent
   D574339
Priority
Jun 24 2005
Filed
Dec 22 2005
Issued
Aug 05 2008
Expiry
Aug 05 2022
Assg.orig
Entity
unknown
13
12
n/a
The ornamental design for a pattern formed on the ground layer of a multilayer printed circuit board, as shown and described.

FIG. 1 shows a front view of the design according to a first embodiment of the present invention.

FIG. 2 shows a back view of the design according to a first embodiment of the present invention.

FIG. 3 shows a top plan view of the design according to a first embodiment of the present invention.

FIG. 4 shows a bottom plan view of the design according to a first embodiment of the present invention.

FIG. 5 shows a left side view of the design according to a first embodiment of the present invention.

FIG. 6 shows a right side view of the design according to a first embodiment of the present invention.

FIG. 7 shows a partial view of FIG. 1 corresponding to the area indicated by the dashed box in FIG. 1.

FIG. 8 shows a detailed view of an enlarged portion of FIG. 7 indicated by the dashed box in FIG. 7.

FIG. 9 shows a sectional view along the line 99 indicated in FIG. 7.

FIG. 10 shows a front plan view of the design according to a second embodiment of the present invention. In this embodiment, the ground layer is transparent.

FIG. 11 shows a back view of the design according to a second embodiment of the present invention.

FIG. 12 shows a top plan view of the design according to a second embodiment of the present invention.

FIG. 13 shows a bottom plan view of the design according to a second embodiment of the present invention.

FIG. 14 shows a right side view of the design according to a second embodiment of the present invention.

FIG. 15 shows a left side view of the design according to a second embodiment of the present invention.

FIG. 16 shows a partial view of FIG. 11 corresponding to the area indicated by the dashed box in FIG. 11.

FIG. 17 shows a detailed view of an enlarged portion of FIG. 17 indicated by the dashed box in FIG. 17; and,

FIG. 18 shows a sectional view along the line 1919 indicated in FIG. 17.

The broken lines represent unclaimed subject matter.

Yamazaki, Hiroshi, Naito, Toshiki, Honjo, Mitsuru

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 11 2005HONJO, MITSURUNitto Denko CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0174100778 pdf
Oct 11 2005YAMAZAKI, HIROSHINitto Denko CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0174100778 pdf
Oct 11 2005NAITO, TOSHIKINitto Denko CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0174100778 pdf
Dec 22 2005Nitto Denko Corporation(assignment on the face of the patent)
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