Patent
   D540273
Priority
Apr 18 2005
Filed
Sep 22 2005
Issued
Apr 10 2007
Expiry
Apr 10 2021

TERM.DISCL.
Assg.orig
Entity
unknown
2
10
n/a
The ornamental design for a semiconductor module, as shown.

FIG. 1 is a front view of a semiconductor module showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a left side view thereof; and,

FIG. 6 is a right side view thereof.

The broken lines shown in the drawings are for illustrative purposes only and form no part of the claimed design.

Higashibata, Kazuaki

Patent Priority Assignee Title
D600219, Apr 26 2006 PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD Lead frame
D942974, Nov 20 2018 THALES DIS AIS DEUTSCHLAND GMBH Cellular module
Patent Priority Assignee Title
5994772, Dec 19 1996 LG Semicon Co., Ltd. Semiconductor package
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6373447, Dec 28 1998 KAWASAKI MICROELECTRONICS, INC On-chip antenna, and systems utilizing same
6781239, Dec 05 2001 National Semiconductor Corporation Integrated circuit and method of forming the integrated circuit having a die with high Q inductors and capacitors attached to a die with a circuit as a flip chip
6836002, Mar 09 2000 III Holdings 10, LLC Semiconductor device
6992395, Jul 04 2001 Sony Corporation Semiconductor device and semiconductor module having external electrodes on an outer periphery
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D318461, Apr 13 1988 IBIDEN CO , LTD , A JAPANESE CORP Semi-conductor mounting substrate
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 25 2005HIGASHIBATA, KAZUAKIMURATA MANUFACTURING CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0170220419 pdf
Sep 22 2005Murata Manufacturing Co., Ltd.(assignment on the face of the patent)
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